Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
calcium-ruthenate-sputter-target-1-removebg-preview-1

ST0337 Calcium Ruthenate Sputtering Target, CaRuO3

Chemical Formula:CaRuO3
Catalog Number: ST0337
CAS Number:
Purity:99.90%
Shape:Discs, Plates, Step Targets, Custom-made

 Calcium Ruthenate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Calcium Ruthenate Sputtering Target Description

CalciumCalcium is a chemical element with the symbol “Ca” and an atomic number of 20. The name “calcium” is derived from the Latin word ‘calx,’ meaning lime. It was first mentioned in 1808 and observed by Sir Humphry Davy, who also accomplished and announced its isolation. Calcium is located in Period 4 and Group 2 of the periodic table, belonging to the s-block elements. Its relative atomic mass is approximately 40.078 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Calcium Sputtering Target

RutheniumRuthenium is a chemical element with the symbol “Ru” and an atomic number of 44. The name “ruthenium” is derived from the Latin name ‘Ruthenia,’ referring to Russia. It was first mentioned in 1807 and observed by Jedrzej Sniadecki, who also accomplished and announced its isolation. Ruthenium is located in Period 5 and Group 8 of the periodic table, belonging to the d-block elements. Its relative atomic mass is approximately 101.07 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Ruthenium Sputtering Target

Calcium Ruthenate Sputtering Target Application

The Calcium Ruthenate Sputtering Target is utilized in a variety of applications, including thin film deposition and decorative coatings. It is widely employed in the semiconductor industry, display technologies, and the production of LEDs and photovoltaic devices. Additionally, this material is significant for functional coatings, the optical information storage industry, glass coatings for automotive and architectural glass, and optical communication technologies.

Calcium Ruthenate Sputtering Target Packing

Our Calcium Ruthenate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take extensive precautions to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Get Contact

TFM offers Calcium Ruthenate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0337 Calcium Ruthenate Sputtering Target, CaRuO3”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top