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ST0339 Barium Niobate Sputtering Target, BaNbO3

Chemical Formula: BaNbO3
Catalog Number: c
CAS Number: 12009-14-2
Purity: 99.99%
Shape: Discs, Plates, Step Targets, Custom-made

Barium Niobate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Barium Niobate Sputtering Target Description

BariumBarium is a chemical element with the symbol “Ba” and an atomic number of 56. The name “barium” originates from the Greek word ‘barys,’ meaning heavy. It was first mentioned in 1772 and observed by Carl Wilhelm Scheele. The isolation of barium was later accomplished and announced by Sir Humphry Davy. Barium is located in Period 6 and Group 2 of the periodic table, belonging to the s-block elements. Its relative atomic mass is approximately 137.327 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Barium Sputtering Target

niobiumNiobium is a chemical element with the symbol “Nb” and an atomic number of 41. The name “niobium” originates from Niobe, the daughter of King Tantalus in Greek mythology. It was first mentioned in 1801 and observed by Charles Hatchett. The isolation of niobium was later accomplished and announced by Wilhelm Blomstrand. Niobium is located in Period 5 and Group 5 of the periodic table, belonging to the d-block elements. Its relative atomic mass is approximately 92.90638 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Niobium Sputtering Target

Barium Niobate Sputtering Target Application

The Barium Niobate Sputtering Target is utilized in a variety of applications, including thin film deposition and decorative coatings. It is widely employed in the semiconductor industry, display technologies, and the production of LEDs and photovoltaic devices. Additionally, this material is significant for functional coatings, the optical information storage industry, glass coatings for automotive and architectural glass, and optical communication technologies.

Barium Niobate Sputtering Target Packaging

Our Barium Niobate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

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TFM offers Barium Niobate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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