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ST0492 Cobalt Niobium Zirconium Sputtering Target, Co/Nb/Zr

Chemical Formula: Co/Nb/Zr
Catalog Number: ST0492
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cobalt Niobium Zirconium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

Introduction

Cobalt Niobium Zirconium (Co/Nb/Zr) sputtering targets are advanced alloy materials engineered for functional thin films that require a balance of magnetic performance, thermal stability, and corrosion resistance. By combining cobalt’s magnetic properties with the high-temperature stability of niobium and zirconium, this multi-component system is particularly valuable in next-generation electronics, magnetic storage, and protective coatings.


Detailed Description

Co/Nb/Zr sputtering targets are typically produced via vacuum melting, powder metallurgy, or hot isostatic pressing (HIP) to achieve a dense, homogeneous microstructure. Careful control of alloy composition ensures uniform sputtering behavior and stable film composition during deposition.

Cobalt contributes strong magnetic characteristics and electrical conductivity, making the alloy suitable for magnetic and electronic thin films. Niobium enhances structural stability, reduces grain growth at elevated temperatures, and improves resistance to diffusion. Zirconium plays a critical role in refining grain structure, improving oxidation resistance, and enhancing film adhesion to various substrates.

These targets are designed for compatibility with DC and RF magnetron sputtering systems. For high-power or large-area deposition, they can be bonded to copper backing plates using indium or elastomer bonding, improving heat dissipation and extending target lifetime.

Key features include:

  • Multi-element alloy design for tailored film properties

  • High density and uniform composition for stable sputtering

  • Enhanced thermal and oxidation resistance compared to pure metals

  • Improved magnetic and mechanical performance

  • Customizable composition ratios (e.g., Co:Nb:Zr atomic or weight %)


Applications

Cobalt Niobium Zirconium sputtering targets are widely used in advanced coating and electronics industries:

  • Magnetic thin films and data storage devices

  • Spintronic materials and magnetoelectric applications

  • Semiconductor barrier and functional layers

  • Wear-resistant and corrosion-resistant coatings

  • Thin film resistors and electronic components

  • Research and development of multi-component alloy films


Technical Parameters

ParameterTypical Value / RangeImportance
CompositionCo/Nb/Zr (custom ratios)Determines magnetic & structural properties
Purity99.9% – 99.99%Reduces contamination in films
Density≥ 99% theoreticalEnsures stable sputtering rate
Diameter25 – 300 mm (custom)Fits various sputtering systems
Thickness3 – 8 mmInfluences target lifetime
BondingCopper backing (In / elastomer)Improves heat dissipation
Grain StructureFine, homogeneousEnsures uniform film deposition

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Co/Nb/ZrBalanced magnetic & thermal stabilitySpintronics, magnetic films
Cobalt (Co)Strong magnetic propertiesMagnetic coatings
Niobium (Nb)High-temperature stabilityBarrier layers
Zirconium (Zr)Corrosion resistance, grain refinementProtective coatings

FAQ

QuestionAnswer
Can the alloy composition be customized?Yes, Co/Nb/Zr ratios can be tailored to meet specific functional requirements.
What sputtering methods are supported?Suitable for DC and RF magnetron sputtering systems.
Is bonding necessary for this target?For high-power applications, bonding to a copper backing plate is recommended.
What industries use this material most?Electronics, magnetic storage, semiconductor, and advanced coatings industries.
How is the target packaged?Vacuum-sealed with protective materials to prevent contamination and damage.

Packaging

Our Cobalt Niobium Zirconium Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.


Conclusion

Cobalt Niobium Zirconium sputtering targets provide a versatile solution for advanced thin film applications that demand a combination of magnetic performance, thermal stability, and durability. With customizable compositions and high manufacturing standards, they are well suited for both industrial-scale production and cutting-edge research.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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