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ST0498 Iridium Manganese Sputtering Target, Ir/Mn

Chemical Formula: Ir/Mn
Catalog Number: ST0498
CAS Number: 12142-03-9
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Iridium Manganese sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Iridium Manganese Sputtering Target Description

IridiumIridium is a rare and exceptionally dense metal, known for its hardness, lustrous appearance, and brittleness. It is highly resistant to corrosion, making it one of the most enduring metals, withstanding attack from nearly all acids. Iridium is often recognized as the second densest element, following osmium, though calculations related to their space lattices suggest that iridium may, in fact, be denser.

manganeseManganese is a chemical element with a name derived either from the Latin word ‘magnes’, meaning magnet, or from the term ‘magnesia nigra’, referring to black magnesium oxide. First identified in 1770 by O. Bergman, its isolation was later achieved by G. Gahn. The chemical symbol for manganese is “Mn,” and it has an atomic number of 25. Located in Period 4 and Group 7 of the periodic table, manganese belongs to the d-block of elements. Its relative atomic mass is 54.938045(5) Dalton, with the number in parentheses indicating the degree of uncertainty.

Related Products: Iridium Sputtering Target, Manganese Sputtering Target.

Iridium Manganese Sputtering Target Specifications

Material TypeIridium Manganese
SymbolIr/Mn
Color/AppearanceGray metallic solid in various forms
Melting Point117 °C
Density/
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Iridium Manganese Sputtering Target Application

The Iridium Manganese Sputtering Target is ideal for a range of applications including thin film deposition, decorative coatings, and semiconductor fabrication. It is also used in the production of displays, LEDs, and photovoltaic devices. This target is suited for functional coatings and plays a role in optical information storage, as well as in the glass coating industry, such as automotive and architectural glass. Additionally, it is utilized in optical communication technologies.

Iridium Manganese Sputtering Target Packing

Our Iridium Manganese Sputtering Targets are meticulously tagged and labeled on the outside to facilitate easy identification and uphold rigorous quality control standards. We prioritize the protection of these targets from potential damage during both storage and transportation.

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TFM offers Iridium Manganese Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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