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Tungsten Titanium Sputtering Target

ST0511 Tungsten Titanium Sputtering Target, W/Ti

Chemical Formula: W/Ti
Catalog Number: ST0511
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tungsten Titanium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Tungsten Titanium (W/Ti) sputtering targets are widely used in thin film deposition where a balance of high density, strong adhesion, and controlled electrical properties is required. As a composite or alloy target, W/Ti combines the excellent thermal stability and hardness of tungsten with the adhesion-promoting and ductile characteristics of titanium, making it a preferred material in semiconductor and microelectronics manufacturing.

Detailed Description

W/Ti sputtering targets are typically produced through powder metallurgy or vacuum melting processes to achieve a homogeneous composition and high density. The ratio of tungsten to titanium can be precisely controlled (commonly 90/10, 80/20 wt%) to tailor film properties such as resistivity, stress, and adhesion.

Tungsten contributes high melting point (~3422°C), excellent wear resistance, and low diffusion characteristics, while titanium enhances film adhesion to substrates such as silicon, glass, or dielectric layers. This combination makes W/Ti an ideal barrier and adhesion layer in integrated circuits and thin film stacks.

The microstructure of the target is engineered to ensure uniform sputtering behavior, minimizing arcing and particle generation. W/Ti targets are compatible with DC magnetron sputtering systems due to their conductive nature and can be supplied as planar or rotatable configurations. For high-power applications, bonding to copper backing plates significantly improves thermal management and target lifetime.

Key features include:

  • Adjustable W/Ti composition for tailored film properties

  • Excellent adhesion to a wide range of substrates

  • High thermal stability and مقاومت to diffusion

  • Uniform microstructure for stable sputtering performance

  • Available with copper backing plates for enhanced heat dissipation

Applications

W/Ti sputtering targets are widely used in:

  • Semiconductor barrier and adhesion layers

  • Integrated circuits (IC) and microelectronics

  • Thin film resistors and conductive layers

  • Diffusion barriers in metallization stacks

  • MEMS devices and microfabrication

  • Optical and protective coatings

Technical Parameters

ParameterTypical Value / RangeImportance
CompositionW/Ti (e.g., 90/10, 80/20 wt%)Controls film properties
Purity99.9% – 99.99%Reduces contamination
Density≥ 95% theoreticalEnsures stable sputtering
Diameter50 – 300 mm (custom available)System compatibility
Thickness3 – 6 mmInfluences target lifetime
Electrical TypeConductiveSuitable for DC sputtering
BondingCu backing / In / elastomerImproves heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
W/TiStrong adhesion + diffusion barrierSemiconductor layers
Pure Tungsten (W)High ताप stabilityHard coatings
Pure Titanium (Ti)Excellent adhesionAdhesion layers
TiNHard, wear-resistant coatingDecorative & protective films

FAQ

QuestionAnswer
What compositions are commonly used?Typical ratios include W/Ti 90/10 and 80/20 by weight.
Is DC sputtering suitable?Yes, W/Ti targets are conductive and compatible with DC magnetron sputtering.
Can the target be customized?Yes, composition, size, and bonding options can be tailored.
Why use W/Ti instead of pure tungsten?The addition of titanium significantly improves adhesion to substrates.
Which industries use W/Ti targets most?Semiconductor manufacturing, MEMS, and thin film electronics.

Packaging

Our Tungsten Titanium Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Tungsten Titanium sputtering targets offer an optimal combination of mechanical strength, thermal stability, and adhesion performance for advanced thin film applications. With flexible composition control and reliable manufacturing quality, they are an essential material for semiconductor and microelectronic industries.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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