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ST0511 Tungsten Titanium Sputtering Target, W/Ti

Chemical Formula: W/Ti
Catalog Number: ST0511
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tungsten Titanium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tungsten Titanium Sputtering Target Description

Explore the exceptional properties of Tungsten Titanium Sputtering Targets and uncover their diverse applications across industries. This page highlights the unique qualities of integrating Tungsten and Titanium in thin film deposition, paving the way for innovative solutions.

Tungsten: The Resilient Rare Metal

Tungsten, a rare metal, is found in compounds with other elements and has the highest melting point of 3422 °C and boiling point of 5930 °C. While polycrystalline tungsten is brittle and hard, pure single-crystalline tungsten is more ductile and can be cut with precision.

Titanium: A Spectrum of Excellence

Titanium, a lustrous transition metal, is known for its silver color, low density, and strength. It resists corrosion in seawater, aqua regia, and chlorine, making it highly versatile. Titanium sputtering targets are essential in applications such as CD-ROMs, decorative elements, flat panel displays, and optical communication.

Tungsten Titanium Sputtering Target Specifications

SpecificationDetails
Material TypeTungsten Titanium
SymbolW/Ti
Color/AppearanceSolid
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″. Thick: 0.125″, 0.250″. Custom shapes and sizes available on inquiry.
PackingTargets are tagged and labeled externally for identification and quality control. Careful handling during storage and transportation.

Tungsten Titanium Sputtering Target Applications

Advanced Thin Film Deposition: Tungsten Titanium sputtering targets enable precise and high-quality thin film creation for diverse applications.

Strength and Versatility: Combining Tungsten and Titanium enhances material strength and adaptability, driving innovation.

Industry Advancement: The integration of these elements propels progress in sectors such as semiconductors and optics.

Tungsten Titanium Sputtering Target Advantages

Exceptional Resilience: Tungsten’s high melting and boiling points combined with Titanium’s strength enhance the durability of thin film depositions.

Diverse Applications: Tungsten Titanium sputtering targets are versatile, suitable for precision cutting, optical communication, and more.

Innovation Catalyst: Integrating Tungsten and Titanium fuels advances in cutting-edge technologies across various sectors.

Unlock the potential of Tungsten Titanium Sputtering Targets and leverage their unique properties for groundbreaking applications. Contact us today to explore customized solutions that drive your innovation forward.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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