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ST0512 Zirconium Yttrium Sputtering Target, Zr/Y

Chemical Formula: Zr/Y
Catalog Number: ST0512
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium Yttrium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Zirconium Yttrium Sputtering Target (Zr/Y) is an advanced alloy target used in physical vapor deposition (PVD) processes to produce high-performance thin films. By combining zirconium and yttrium, this material offers enhanced oxidation resistance, thermal stability, and structural durability in demanding environments. These properties make Zr/Y sputtering targets particularly valuable for applications in protective coatings, energy systems, aerospace components, and high-temperature functional films.

Zirconium-based coatings are known for their corrosion resistance and strong adhesion, while yttrium plays a critical role in improving oxide scale stability and high-temperature oxidation resistance. Together, the Zr/Y alloy enables the deposition of durable thin films with improved mechanical integrity and long-term performance.

Detailed Description

Zirconium Yttrium sputtering targets are typically produced using high-purity raw materials and advanced metallurgical processes such as vacuum melting, hot isostatic pressing (HIP), or powder metallurgy. These processes help achieve high density, uniform grain structure, and excellent compositional homogeneity, which are essential for stable sputtering performance.

The addition of yttrium significantly enhances the high-temperature behavior of zirconium-based coatings. Yttrium acts as an oxide stabilizer, helping to form dense and adherent oxide layers during exposure to elevated temperatures. This mechanism reduces oxygen diffusion and slows down degradation in harsh environments.

In thin film deposition, Zr/Y targets are frequently used to produce coatings that exhibit improved thermal barrier performance, oxidation resistance, and mechanical stability. The alloy composition can be customized depending on the desired coating properties, allowing researchers and engineers to optimize film characteristics for specific applications.

For high-power sputtering systems, Zr/Y targets can be supplied with copper backing plates using indium bonding or diffusion bonding techniques, ensuring efficient heat transfer and minimizing thermal stress during operation. High-density targets also reduce particle generation and maintain consistent sputtering rates.

Applications

Zirconium Yttrium sputtering targets are widely used in several advanced technology sectors, including:

  • Thermal barrier coatings (TBCs) used in aerospace and turbine components

  • Protective coatings for high-temperature industrial equipment

  • Oxide-stabilized coatings in energy systems and fuel cells

  • Semiconductor and electronic thin films requiring high thermal stability

  • Optical coatings where chemical stability and durability are critical

  • Research laboratories developing advanced alloy and ceramic thin films

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%High purity ensures consistent thin film composition
CompositionZr/Y ratio customizable (e.g., 95/5, 90/10)Determines oxidation resistance and film properties
Diameter25 – 300 mm (custom)Compatible with most sputtering systems
Thickness3 – 6 mmInfluences target lifetime and sputtering stability
Density≥ 99% theoretical densityReduces particle formation and improves film uniformity
BondingCopper backing plate / Indium bondedEnhances heat transfer and target durability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Zirconium Yttrium (Zr/Y)Enhanced oxidation resistance and thermal stabilityThermal barrier and protective coatings
Zirconium (Zr)Excellent corrosion resistanceStructural and protective coatings
Yttrium (Y)Oxide stabilization and improved high-temperature durabilityAlloy additives and ceramic coatings

FAQ

QuestionAnswer
Can the Zr/Y composition be customized?Yes. The zirconium-to-yttrium ratio can be adjusted according to coating performance requirements.
Are bonded targets available?Yes. Copper backing plates with indium or diffusion bonding are commonly supplied for improved thermal management.
Which deposition methods are compatible with Zr/Y targets?Zr/Y sputtering targets are suitable for DC magnetron sputtering, RF sputtering, and other PVD deposition techniques.
What purity levels are available?Standard purity ranges from 99.9% to 99.99%, depending on application requirements.
Can special sizes or shapes be manufactured?Yes. Targets can be customized in diameter, thickness, and geometry to match different sputtering systems.

Packaging

Our Zirconium Yttrium Sputtering Target (Zr/Y) products are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control. Each target is carefully packed using vacuum-sealed packaging, protective foam materials, and export-grade cartons or wooden crates. These measures prevent contamination, oxidation, and mechanical damage during storage and transportation, ensuring that the sputtering targets arrive in optimal condition.

Conclusion

The Zirconium Yttrium Sputtering Target (Zr/Y) offers a reliable solution for producing high-performance thin films with excellent thermal stability, oxidation resistance, and structural durability. By combining the strengths of zirconium and yttrium, this alloy target enables advanced coatings used in aerospace, energy, semiconductor, and research applications.

With customizable compositions, high-density manufacturing, and flexible target configurations, Zr/Y sputtering targets provide consistent and dependable deposition performance.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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