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ST0882 Lithium Phosphorus Sulfide Sputtering Target, Li3PS4

Chemical Formula: Li3PS4
Catalog Number: ST0882
Purity: 99.9% ~ 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium Phosphorus Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Lithium Phosphorus Sulfide (Li₃PS₄) sputtering targets are advanced solid electrolyte materials designed for thin film deposition in next-generation energy storage technologies. As a key sulfide-based lithium-ion conductor, Li₃PS₄ enables the fabrication of high-performance solid-state batteries, offering improved safety, high ionic conductivity, and compatibility with scalable thin film processes.


Detailed Description

Li₃PS₄ sputtering targets are typically fabricated using controlled powder synthesis followed by cold pressing, hot pressing, or spark plasma sintering (SPS) to achieve dense, homogeneous structures. Due to the moisture sensitivity of sulfide electrolytes, strict environmental controls (e.g., inert atmosphere processing) are required during manufacturing and handling to prevent hydrolysis and degradation.

This material is known for its relatively high lithium-ion conductivity compared to oxide-based electrolytes, making it suitable for solid-state battery applications. The amorphous or glass-ceramic nature of Li₃PS₄ films deposited via RF magnetron sputtering can further enhance ionic transport and interfacial contact with electrodes.

Because Li₃PS₄ is electrically insulating but ionically conductive, RF sputtering is typically used. Targets can be supplied as bonded or unbonded discs, with backing plates (such as copper) improving mechanical stability during deposition. Special attention is given to target density and compositional uniformity to ensure stable sputtering behavior and reproducible thin film performance.

Key features include:

  • High lithium-ion conductivity for solid electrolyte applications

  • Suitable for RF magnetron sputtering deposition

  • Glass-ceramic structure enabling enhanced ionic transport

  • Controlled microstructure for stable sputtering performance

  • Manufactured under inert conditions to maintain material integrity


Applications

Li₃PS₄ sputtering targets are widely used in:

  • Solid-state thin film batteries

  • Lithium-ion and next-generation energy storage devices

  • Solid electrolyte thin films for microbatteries

  • Interface engineering in battery systems

  • Research in sulfide-based electrolytes

  • Flexible and miniaturized energy storage devices


Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaLi₃PS₄Defines electrolyte composition
Purity99.9% – 99.99%Ensures ionic conductivity stability
Density≥ 90% – 98% theoreticalAffects sputtering uniformity
Diameter50 – 150 mm (custom available)Matches deposition systems
Thickness3 – 6 mmDetermines target lifetime
Ionic Conductivity~10⁻⁴ – 10⁻³ S/cm (bulk, typical)Key performance metric
Sputtering TypeRF magnetronRequired for insulating materials

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Li₃PS₄High ionic conductivity, flexible filmSolid-state batteries
LLZO (Li₇La₃Zr₂O₁₂)Excellent chemical stabilityBulk solid electrolytes
LiPONGood thin film stabilityThin film batteries
LGPSVery high ionic conductivityAdvanced battery research

FAQ

QuestionAnswer
Is Li₃PS₄ sensitive to moisture?Yes, it is highly moisture-sensitive and must be handled in inert environments.
What sputtering method is recommended?RF magnetron sputtering is typically used due to its insulating nature.
Can the target be customized?Yes, size, density, and bonding options can be tailored.
What is the main advantage over oxide electrolytes?Higher ionic conductivity and better interface compatibility.
Which industries use Li₃PS₄ most?Energy storage, battery R&D, and advanced electronics.

Packaging

Our Lithium Phosphorus Sulfide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. Special moisture-barrier packaging (such as vacuum sealing with desiccants or inert gas filling) is used to protect the material from degradation during storage and transportation, ensuring the targets arrive in optimal condition.


Conclusion

Lithium Phosphorus Sulfide (Li₃PS₄) sputtering targets represent a critical material for advancing solid-state battery technologies. With high ionic conductivity, compatibility with thin film deposition, and customizable configurations, they provide a reliable solution for cutting-edge energy storage applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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