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ST0002 Antimony Sputtering Target

Chemical Formula: Sb
Catalog Number: ST0002
CAS Number: 7440-36-0
Purity: 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Antimony Sputtering Targets come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Antimony Sputtering Target (Sb) is a high-purity elemental target widely used in thin film deposition processes for semiconductor, optical, and electronic applications. Antimony is a metalloid with unique electrical and optical properties, making it an important component in phase-change materials, infrared devices, thermoelectric materials, and compound semiconductors.

Using magnetron sputtering or other physical vapor deposition (PVD) techniques, antimony sputtering targets enable the deposition of thin films with controlled thickness and composition. These films are widely utilized in data storage technologies, optoelectronics, photovoltaic devices, and advanced materials research.

Detailed Description

Antimony sputtering targets are typically manufactured from high-purity antimony metal using processes such as vacuum melting, casting, and precision machining. These manufacturing methods ensure a dense and homogeneous target structure, which is essential for stable sputtering performance and uniform thin film deposition.

Antimony has semimetallic electrical characteristics and exhibits strong optical absorption in certain spectral ranges. In thin film technology, it is often used either as a pure element or as a precursor material for various compound semiconductors.

One of the most significant applications of antimony thin films is in phase-change memory materials, where antimony-based compounds such as GeSbTe are used in non-volatile memory devices. Antimony also plays a critical role in thermoelectric materials and infrared-sensitive semiconductor systems.

High-density sputtering targets help ensure stable sputtering rates and minimize particle generation during deposition. For high-power sputtering systems, antimony targets can be supplied as bonded targets with copper backing plates, typically using indium bonding to improve thermal management and mechanical stability during sputtering.

Applications

Antimony sputtering targets are widely used in several advanced technology sectors:

  • Phase-change memory materials used in data storage technologies

  • Compound semiconductor deposition such as Sb-based alloys and chalcogenides

  • Thermoelectric materials research

  • Infrared detectors and optoelectronic devices

  • Thin film electronics and sensors

  • Advanced materials research involving Sb-containing compounds

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.999%High purity ensures stable electronic and optical film properties
Chemical SymbolSbDetermines elemental composition of thin films
Diameter25 – 300 mm (custom)Compatible with standard sputtering systems
Thickness3 – 6 mmInfluences sputtering efficiency and target lifespan
Density≥ 99% theoretical densityEnsures uniform sputtering and film growth
BondingCopper backing plate / Indium bondedImproves heat dissipation during deposition

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Antimony (Sb)Important component in phase-change and thermoelectric materialsMemory devices and semiconductor films
Bismuth (Bi)Strong thermoelectric propertiesEnergy conversion materials
Tellurium (Te)Semiconductor and thermoelectric functionalityInfrared detectors and thermoelectric systems

FAQ

QuestionAnswer
What sputtering methods are suitable for antimony targets?Antimony sputtering targets are commonly used in DC or RF magnetron sputtering systems depending on system configuration.
Can the target size be customized?Yes. Diameter, thickness, and bonding configurations can be tailored to specific sputtering systems.
Are bonded sputtering targets available?Yes. Antimony targets can be bonded to copper backing plates using indium bonding to improve thermal conductivity and stability.
What purity levels are typically available?Standard purities range from 99.9% to 99.999%, depending on application requirements.
What substrates can antimony thin films be deposited on?Antimony films can be deposited on silicon wafers, glass, ceramic substrates, and metallic surfaces.

Packaging

Our Antimony Sputtering Target (Sb) products are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control standards. Each target is carefully packaged in vacuum-sealed bags with protective foam materials and export-grade cartons or wooden crates to prevent contamination, oxidation, and mechanical damage during storage and transportation.

Conclusion

The Antimony Sputtering Target (Sb) provides a reliable solution for depositing high-quality thin films used in semiconductor devices, phase-change memory technologies, and advanced optoelectronic materials. Its unique electronic properties and compatibility with various compound systems make it an essential material for modern thin film applications.

With high purity levels, customizable dimensions, and stable sputtering performance, antimony sputtering targets support both industrial production and cutting-edge research in advanced materials science.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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Sb Target 4N 150*50*3mm Indium Bonded 3mm Cu B/Plate, Sb Target 4N 150*50*6mm Indium Bonded 3mm Cu B/Plate, Sb Target ø50.8×3mm Indium Bonded 2mm Cu B/Plate, Sb Target 3N ø15×1.0mm, Sb Target 4N ø2"×3mm Indium Bonded 3mm Cu B/Plate, Sb target 5N 2"×3.18 mm In bonded to 2 mm Cu BP, Sb target 4N ø200×6 mm, Sb Target 4N Ø2"×6.35 mm, Sb Target 5N Ø2"×6.35 mm, Sb Disc 3N Ø15×10 mm, Sb 99.999%, 1.00" Dia. × 0.125" Thick ST0002-01, Sb 99.999%, 1.00" Dia. × 0.250" Thick ST0002-02, Sb 99.999%, 2.00" Dia. × 0.125" Thick ST0002-03, Sb 99.999%, 2.00" Dia. × 0.250" Thick ST0002-04, Sb 99.999%, 3.00" Dia. × 0.125" Thick ST0002-05, Sb 99.999%, 3.00" Dia. × 0.250" Thick ST0002-06, Sb 99.999%, 4.00" Dia. × 0.125" Thick ST0002-07, Sb 99.999%, 4.00" Dia. × 0.250" Thick ST0002-08, Sb 99.999%, 6.00" Dia. × 0.125" Thick ST0002-09, Sb 99.999%, 6.00" Dia. × 0.250" Thick ST0002-10, Sb TRG 4N ø2"*3.18mm, Sb TRG 4N Ø2″×3.18mm, Sb TRG 4N Ø1″×3.18mm Bonded to 3mm Cu BP, Sb TRG 4N Ø3″×3.18mm Bonded to 3mm Cu BP

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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