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N-type Silicon Evaporation Materials

VD0576 N-type Silicon Evaporation Materials, Si

Material: Silicon (Si) (N-type)
Purity: 99.9% ~ 99.999%
Shape: Powder/ Granule/ Custom-made
Color/Appearance: Dark Gray with a Bluish Tinge, Semi-Metallic

N-type silicon evaporation materials come in a variety of forms, purities, sizes, and price ranges. TFM provides premium N-type silicon evaporation pellets, offering exceptional quality at highly competitive prices.

MSDS File

N-type Silicon Evaporation Materials Description

Silicon, classified as a metalloid, exhibits characteristics of both metals and nonmetals. This element is known for its exceptional resistance to chemical reactions, remaining inert and insoluble in water and most acids. However, when exposed to hot alkaline solutions, silicon can be dissolved, forming silicates. In its pure form, silicon manifests as dark gray, shiny crystals with a metallic luster. Its thermal conductivity is notably high, yet it maintains low electrical conductivity unless modified.

In deposition processes, high purity N-type Silicon is crucial for achieving superior film quality. TFM specializes in providing Silicon evaporation materials with a purity of up to 99.999%. These materials undergo stringent quality assurance measures to ensure consistent performance and reliability in demanding applications.

This specialized silicon, when alloyed with aluminum, further enhances the material’s strength while reducing its weight, making it indispensable in various high-tech industries.

silicon n type evaporation materials

N-type Silicon Evaporation Materials Specification

Material TypeN-type Silicon
SymbolSi
Color/AppearanceDark Gray with a Bluish Tinge, Semi-Metallic
Melting Point1,410 °C
Density2.32 g/cc
Thermal Conductivity150 W·m-1·K-1 (25°C)
Thermal Expansion2.6 x 10-6/K (25°C)
Bulk Resistivity0.005-0.020 OHM-CM
SynonymsN-type Silicon Pellets, N-type Silicon Pieces, N-type Silicon Evaporation Pellet, N-type Si Pellets, N-type Si Pieces, N-type Si Evaporation Pellet

N-type Silicon Evaporation Materials Application

Silicon evaporation materials are integral to several deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). Their role is essential for attaining precise and high-quality outcomes in these processes. Additionally, these materials find applications in optics, where they are used for wear protection, decorative coatings, and display technologies, contributing to both functional and aesthetic enhancements.

N-type Silicon Evaporation Materials Packaging

We meticulously manage our N-type evaporation materials to safeguard them from damage during both storage and transportation, ensuring that they retain their high quality and remain in pristine condition.

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TFM offers N-type silicon evaporation materials in a range of forms, purities, sizes, and price points. We focus on producing high-purity e-beam evaporation materials, emphasizing the highest density and the smallest average grain sizes. For the latest pricing on evaporation pellets and other deposition materials not listed, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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