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Tungsten Carbide (WC) Evaporation Materials

Catalog No.WC-VD
MaterialTungsten Carbide (WC)
Purity99.5% ~ 99.9%
ShapePowder/ Granule/ Custom-made

TFM offers high-purity Tungsten Carbide (WC) Evaporation Materials, expertly manufactured to meet stringent quality standards for optimal performance in thin film deposition processes.

MSDS File

TFM specializes in producing evaporation materials with up to 99.999% high purity, ensuring product reliability through rigorous quality assurance processes. These materials are essential for deposition processes, including semiconductor deposition, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD), and are widely used in optics, wear protection, decorative coatings, and displays.

TFM offers a variety of shapes, including tablets, granules, rods, and wires, with customization options available upon request. Additionally, TFM provides evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners to support your deposition needs.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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