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Aluminum Chromium Evaporation Materials

VD0593 Aluminum Chromium Evaporation Materials, Al/Cr

Catalog No.VD0593
MaterialAluminum Chromium (Al/Cr)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM provides high-purity aluminum chromium evaporation materials, catering to a range of deposition needs. As a leading manufacturer and supplier, TFM offers these materials in various forms, including powder and granules, with custom options available to meet specific requirements.

MSDS File

Aluminum Chromium Evaporation Materials Overview

High-purity aluminum chromium evaporation materials are essential for achieving top-quality films in deposition processes. TFM specializes in producing aluminum chromium materials with purity levels reaching up to 99.9995%. Our rigorous quality assurance measures ensure that each product meets the highest standards of reliability.

Specifications

Material TypeAluminum Chromium
Color/AppearanceGray
Purity99.9% ~ 99.9995%
ShapePowder/ Granule/ Custom-made

Applications

Aluminum chromium evaporation materials are utilized in:

  • Deposition Processes: Including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applications such as wear protection, decorative coatings, and displays.

Packaging and Handling

We ensure that our aluminum chromium evaporation materials are handled with care to avoid any damage during storage and transportation, maintaining the quality of the products in their original state.

Contact Us

TFM offers a range of high-purity aluminum chromium evaporation materials in various forms, including powder and granules, with custom options available. For current pricing and more information on our products, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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