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Aluminum Silicon Copper Evaporation Materials

VD0599 Aluminum Silicon Copper Evaporation Materials, Al/Si/Cu

Catalog No.VD0599
MaterialAluminum Silicon Copper (Al/Si/Cu)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM specializes in producing high-purity aluminum silicon copper evaporation materials, adhering to stringent quality assurance processes to ensure product reliability. Our aluminum silicon copper evaporation materials are offered in various forms, including tablets, granules, rods, and wires, to meet diverse application needs.

MSDS File

Aluminum Silicon Copper Evaporation Materials

TFM provides high-purity aluminum silicon copper evaporation materials, which are alloys consisting of aluminum (Al), silicon (Si), and copper (Cu). These materials are essential for various deposition processes and offer versatility in applications.

Applications

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Utilized for wear protection, decorative coatings, and displays.

Packaging and Handling

We ensure that our aluminum silicon copper evaporation materials are meticulously handled to avoid damage during storage and transportation. This careful packaging preserves the quality and integrity of the products.

Our Offerings

TFM supplies a comprehensive range of evaporation materials, including:

  • Pure Metals and Alloys: Various compositions and forms available.
  • Ceramic Oxides: Including rare earth oxides like Sc2O3, Y2O3, La2O3, and other ceramics such as fluorides and nitrides.
  • Forms: Tablets, granules, rods, and wires. Custom shapes and quantities are available upon request.
  • Additional Components: Evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners.

For current pricing and availability of evaporation pellets and other deposition materials not listed, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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