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VD0602 Cerium Gadolinium Evaporation Materials, Ce/Gd

Catalog No.VD0602
MaterialCerium Gadolinium (Ce/Gd)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM specializes in producing high-purity cerium gadolinium evaporation materials, adhering to strict quality assurance processes to ensure exceptional product reliability. Our cerium gadolinium evaporation materials are available in various forms, including tablets, granules, rods, and wires, to meet diverse application needs.

MSDS File

Cerium Gadolinium Evaporation Materials

TFM provides high-purity cerium gadolinium evaporation materials, consisting of an alloy of cerium (Ce) and gadolinium (Gd). Our materials achieve up to 99.9995% purity, ensuring the highest quality in deposition processes. These materials are critical for producing high-quality deposited films and are produced under stringent quality assurance processes to guarantee reliability.

Applications

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and display technologies.

Packaging and Handling

We meticulously handle and package our cerium gadolinium evaporation materials to prevent damage during storage and transportation, preserving their quality and integrity.

Our Offerings

TFM is a leading provider of high-purity cerium gadolinium evaporation materials and a wide range of other evaporation pellets. We offer our materials in various forms, including powder and granules, with customized options available upon request. For current pricing and details on other deposition materials not listed, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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