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VD0603 Cerium Samarium Evaporation Materials, Ce/Sm

Catalog No.VD0603
MaterialCerium Samarium (Ce/Sm)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM specializes in producing high-purity cerium samarium evaporation materials, utilizing rigorous quality assurance processes to ensure exceptional product reliability. Our cerium samarium evaporation materials are available in various forms, including tablets, granules, rods, and wires, to meet a wide range of application needs.

Cerium Samarium Evaporation Materials

TFM offers high-purity cerium samarium evaporation materials, which are alloys composed of cerium (Ce) and samarium (Sm). Our materials are produced with up to 99.9995% purity, ensuring superior performance in deposition processes. These high-quality materials are essential for producing top-tier deposited films and are manufactured with stringent quality assurance processes to guarantee reliability.

Applications

  • Deposition Processes: Suitable for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Ideal for wear protection, decorative coatings, and display technologies.

Packaging and Handling

We take great care in handling and packaging our cerium samarium evaporation materials to avoid damage during storage and transportation, ensuring that they retain their high quality and arrive in optimal condition.

What We Offer

TFM is a leading manufacturer and supplier of high-purity cerium samarium evaporation materials, available in various forms such as powder and granules. Customized shapes and quantities can also be provided upon request. For current pricing and availability of these and other deposition materials not listed, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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