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VD0608 Chromium Nickel Evaporation Materials, Cr/Ni

Catalog No.VD0608
MaterialChromium Nickel (Cr/Ni)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

At TFM, we are dedicated to manufacturing high-purity chromium-nickel evaporation materials, ensuring exceptional reliability through rigorous quality assurance processes. Our product range includes a variety of forms to suit different applications, such as tablets, granules, rods, and wires. Each of these products is crafted to meet the highest standards, providing consistent performance for your needs.

Chromium Nickel Evaporation Materials

Introduction

Chromium Nickel evaporation materials are widely used in thin film deposition due to their exceptional combination of mechanical strength, corrosion resistance, and electrical properties. By blending chromium’s hardness and oxidation resistance with nickel’s ductility and conductivity, these evaporation sources enable the production of thin films that meet demanding requirements in electronics, optics, and protective coatings.

Detailed Description

Chromium Nickel evaporation materials are typically prepared in pellet, granule, or custom-formed pieces suitable for thermal and electron beam evaporation systems. The alloy is engineered for high-density and uniform composition, ensuring stable evaporation behavior and consistent thin film properties.

  • Purity: Offered in 99.9% and higher for reduced contamination in critical thin film applications.

  • Composition: Standard Cr-Ni alloy ratios are available, with customization possible to meet specific optical, mechanical, or electronic requirements.

  • Deposition Stability: Designed to minimize spitting and provide uniform evaporation rates, which is critical for achieving defect-free coatings.

  • Film Properties: Films deposited from Chromium Nickel exhibit high adhesion, durability, and good thermal stability, making them suitable for harsh environments.

Applications

Chromium Nickel evaporation materials find applications in multiple industries:

  • Semiconductors – barrier layers and diffusion control.

  • Optical coatings – anti-reflective and decorative finishes.

  • Protective coatings – wear-resistant and corrosion-resistant layers.

  • Aerospace & automotive – durable coatings for components exposed to high stress and temperature.

  • Energy technologies – electrode materials in batteries and thin film solar cells.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures film quality and reduces contamination
Forms AvailablePellets, granules, custom piecesCompatible with e-beam and thermal evaporation
Size Range1 – 20 mm (pellets/granules)Affects evaporation rate stability
Evaporation MethodThermal / Electron beamEnables flexible coating processes
CompositionCr-Ni alloys (custom ratios)Tailors film hardness and conductivity

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Chromium Nickel (Cr-Ni)Balanced corrosion resistance & mechanical strengthProtective & optical coatings
Pure ChromiumExcellent hardness & oxidation resistanceDecorative & wear coatings
Pure NickelHigh conductivity & ductilityElectronic & magnetic films
Nickel Iron (Ni-Fe)Soft magnetic propertiesMagnetic thin films

FAQ

QuestionAnswer
Can the Cr:Ni ratio be customized?Yes, alloy composition can be tailored for specific thin film performance.
What deposition methods are compatible?Suitable for thermal and electron beam evaporation systems.
How are these materials packaged?Vacuum-sealed with inert gas protection, then packed in export-safe cartons or crates.
What purity levels are offered?Typically 3N (99.9%) to 4N (99.99%) depending on requirements.
Which industries benefit most?Semiconductor, optics, aerospace, automotive, and renewable energy.

Packaging

Chromium Nickel evaporation materials are vacuum-sealed and protected with inert gas to prevent oxidation during storage and shipping. They are securely packed with protective foam and placed in export-approved cartons or wooden crates to ensure safe arrival.

Conclusion

Chromium Nickel evaporation materials deliver a reliable combination of durability, conductivity, and corrosion resistance, making them ideal for advanced thin film applications. With customizable compositions and forms, they provide tailored solutions for research and industrial production.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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