Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
nickel-chromium-evaporation-materials-1

VD0608 Nickel Chromium Evaporation Materials, Ni/Cr

Material Type: Nichrome IV
Symbol: Ni/Cr
Purity：99.9% ~ 99.99%
Shape：Powder/ Granule/ Custom-made

TFM specializes in producing high-purity nickel-chromium evaporation materials, adhering to stringent quality assurance processes to ensure exceptional product reliability. Our materials are available in various shapes, including tablets, granules, rods, and wires, catering to diverse application needs.

MSDS File

High-Purity Nickel Chromium Evaporation Materials

TFM provides high-purity nickel-chromium evaporation materials, an alloy consisting of nickel (Ni) and chromium (Cr). These materials are essential in deposition processes, contributing to the production of high-quality deposited films. We ensure that our nickel-chromium materials achieve a purity level of up to 99.9995%, supported by rigorous quality assurance measures to guarantee their reliability.

Nickel-Chromium Evaporation Materials Specifications

Compound FormulaCrNi
AppearanceSilver-gray
Melting Point1395 °C
Theoretical Density8.5 g/cc
Solubility in H2OInsoluble
ShapePowder/ Pellets/ Granule/ Custom-made

Applications of Nickel-Chromium Evaporation Materials

Nickel-chromium evaporation materials are utilized in a variety of applications:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Used for wear protection, decorative coatings, and display technologies.

Product Packaging and Handling

We ensure our nickel-chromium evaporation materials are meticulously packaged to prevent damage during storage and transportation, maintaining their quality in pristine condition.

Contact Us

As a premier manufacturer and supplier, TFM offers nickel-chromium evaporation materials in both powder and granule forms, with customized options available upon request. For up-to-date pricing and inquiries about our evaporation materials or other deposition products not listed, please contact us.

Ordering Table

New wpDataTable

Material Size Quantity Purity Part Number
Nickel/Chromium 1/4" Dia. x 1/4" Length 100 g 99.95% EVMNICRQXQ-D
Nickel/Chromium 1/4" Dia. x 1/4" Length 500 g 99.95% EVMNICRQXQ-T
Nickel/Chromium 1/8" Dia. x 1/8" Length 400 g 99.95% EVMNICR35EXE-P
Nickel/Chromium 1/8" Dia. x 1/8" Length 25 g 99.95% EVMNICREXE-A
Nickel/Chromium 1/8" Dia. x 1/8" Length 50 g 99.95% EVMNICREXE-B
Nickel/Chromium 1/8" Dia. x 1/8" Length 100 g 99.95% EVMNICREXE-D
Nickel/Chromium 1/8" Dia. x 1/8" Length 300 g 99.95% EVMNICREXE-L

Reviews

There are no reviews yet.

Be the first to review “VD0608 Nickel Chromium Evaporation Materials, Ni/Cr”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

Shopping Cart
Scroll to Top