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VD0608 Nickel Chromium Evaporation Materials, Ni/Cr

Material Type: Nichrome IV
Symbol: Ni/Cr
Purity：99.9% ~ 99.99%
Shape：Powder/ Granule/ Custom-made

TFM specializes in producing high-purity nickel-chromium evaporation materials, adhering to stringent quality assurance processes to ensure exceptional product reliability. Our materials are available in various shapes, including tablets, granules, rods, and wires, catering to diverse application needs.

MSDS File

Introduction

Nickel Chromium Evaporation Materials (Ni/Cr), commonly referred to as NiCr alloys, are widely used for depositing resistive, adhesion, and protective thin films in microelectronics and precision coating systems. The Ni–Cr alloy system offers a balanced combination of electrical resistivity, oxidation resistance, and mechanical stability, making it a preferred material for thin film resistors and heating elements.

In vacuum deposition processes such as thermal and electron beam evaporation, compositional stability and alloy homogeneity are essential to ensure predictable electrical performance. Pre-alloyed Ni/Cr evaporation materials provide consistent vapor composition and reliable film characteristics across both laboratory-scale R&D and industrial production lines.

Detailed Description

Nickel (Ni) contributes good electrical conductivity and corrosion resistance, while chromium (Cr) enhances oxidation resistance and increases electrical resistivity. By adjusting the Ni/Cr ratio, film properties such as sheet resistance, temperature coefficient of resistance (TCR), and mechanical stability can be precisely controlled.

Key characteristics include:

  • Pre-Alloyed and Homogeneous Composition – Ensures stable evaporation behavior and consistent thin film resistivity.

  • Customizable Ni/Cr Ratios – Typical compositions include Ni80/Cr20, Ni70/Cr30, or other tailored formulations.

  • High Metal Purity (3N–5N typical) – Reduces contamination and improves film reliability.

  • Dense Microstructure – Minimizes particle generation and ensures uniform deposition.

Ni/Cr evaporation materials are supplied as pieces, granules, or pellets compatible with tungsten boats, molybdenum crucibles, or graphite liners. Due to differences in vapor pressure between nickel and chromium, controlled deposition parameters are recommended to maintain film stoichiometry and resistivity consistency.

NiCr thin films are well-known for their stable resistive properties and long-term reliability under thermal cycling conditions.

Applications

Nickel Chromium Evaporation Materials are widely used in:

  • Thin Film Resistors
    Precision resistor networks in microelectronics and hybrid circuits.

  • Heating Elements & Microheaters
    Resistive layers in MEMS and sensor applications.

  • Adhesion Layers
    Underlayers for gold or copper films in electronic devices.

  • Protective & Barrier Coatings
    Oxidation-resistant metallic films.

  • Research & Development
    Alloy thin film studies and resistivity optimization projects.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.999% (3N–5N)Reduces impurities affecting resistivity
CompositionCustom Ni/Cr ratio (e.g., 80/20)Controls sheet resistance & TCR
FormPieces / Granules / PelletsCompatible with evaporation systems
Melting Range~1350–1450°C (composition-dependent)Influences evaporation control
Density≥ 99% theoreticalEnsures uniform vaporization
PackagingVacuum-sealed / inert-packedPrevents surface oxidation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Nickel Chromium (Ni/Cr)Stable resistivity & good oxidation resistanceThin film resistors
Pure Nickel (Ni)Higher conductivityConductive layers
Pure Chromium (Cr)Strong adhesion & barrier performanceAdhesion layers
Tantalum Nitride (TaN)Low TCR & high stabilityAdvanced resistor films

Compared to pure nickel, Ni/Cr alloys offer higher and more stable resistivity. Compared to tantalum-based resistive materials, NiCr provides a cost-effective and widely adopted solution for precision thin film resistor applications.

FAQ

QuestionAnswer
Can the Ni/Cr ratio be customized?Yes, compositions can be tailored to meet specific sheet resistance and TCR requirements.
Is the material supplied pre-alloyed?Yes, standard Ni/Cr evaporation materials are supplied as pre-alloyed alloys.
What deposition methods are suitable?Compatible with both thermal and electron beam evaporation systems.
Are custom sizes available?Yes, particle size and pellet dimensions can be customized based on equipment needs.
Which industries use NiCr films most?Microelectronics, sensor manufacturing, resistor production, and advanced materials research.

Packaging

Our Nickel Chromium Evaporation Materials are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the materials arrive in perfect condition.

Conclusion

Nickel Chromium Evaporation Materials (Ni/Cr) provide a reliable and compositionally flexible solution for depositing stable resistive and protective thin films. With customizable alloy ratios, high purity standards, and consistent evaporation performance, NiCr materials support demanding microelectronic and precision coating applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Ordering Table

New wpDataTable

Material Size Quantity Purity Part Number
Nickel/Chromium 1/4" Dia. x 1/4" Length 100 g 99.95% EVMNICRQXQ-D
Nickel/Chromium 1/4" Dia. x 1/4" Length 500 g 99.95% EVMNICRQXQ-T
Nickel/Chromium 1/8" Dia. x 1/8" Length 400 g 99.95% EVMNICR35EXE-P
Nickel/Chromium 1/8" Dia. x 1/8" Length 25 g 99.95% EVMNICREXE-A
Nickel/Chromium 1/8" Dia. x 1/8" Length 50 g 99.95% EVMNICREXE-B
Nickel/Chromium 1/8" Dia. x 1/8" Length 100 g 99.95% EVMNICREXE-D
Nickel/Chromium 1/8" Dia. x 1/8" Length 300 g 99.95% EVMNICREXE-L

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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