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Molybdenum Chromium Evaporation Materials

VD0633 Molybdenum Chromium Evaporation Materials, Mo/Cr

talog No.VD0633
MaterialMolybdenum Chromium (Mo/Cr)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM specializes in the production of high-purity molybdenum chromium evaporation materials, employing rigorous quality assurance processes to ensure reliable performance. Our materials come in a variety of forms, including tablets, granules, pellets, and powder, tailored to meet your specific needs.

MSDS File

Molybdenum Chromium Evaporation Materials Overview

TFM produces high-purity molybdenum chromium evaporation materials, an advanced alloy of molybdenum (Mo) and chromium (Cr). With purity levels up to 99.9995%, these materials are crucial for achieving superior quality in deposition processes. Our stringent quality assurance protocols ensure that each product meets the highest standards of reliability and performance.

Applications

Molybdenum chromium evaporation materials are utilized in:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Ideal for applications in wear protection, decorative coatings, and display technologies.

Packaging

We take great care in handling our molybdenum chromium evaporation materials to avoid damage during storage and transportation, ensuring that they arrive in optimal condition.

Contact Us

As a leading manufacturer and supplier, TFM offers molybdenum chromium evaporation materials in various forms, including tablets, granules, rods, and wires. We also provide customized shapes and quantities to meet specific requirements. In addition to evaporation materials, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional information about our products, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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