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Nickel Chromium Aluminum Evaporation Materials

VD0635 Nickel Chromium Aluminum Evaporation Materials, Ni/Cr/Al

Catalog No.VD0635
MaterialNickel Chromium Aluminum
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM stands at the forefront of manufacturing and supplying premium-grade nickel chromium aluminum evaporation materials. We provide a diverse range of evaporation materials, available in both powder and granule forms. For specific needs, we also offer customization options upon request.

 

MSDS File

Nickel Chromium Aluminum Evaporation Materials Overview

Our nickel chromium aluminum evaporation materials, produced by TFM, consist of a high-purity alloy that combines nickel (Ni), chromium (Cr), and aluminum (Al). These materials are essential for achieving high-quality thin films in various deposition processes. TFM ensures the utmost reliability and performance by offering these materials with purity levels up to 99.9995%, thanks to rigorous quality control measures.

Applications of Nickel Chromium Aluminum Evaporation Materials

These materials are utilized in a range of applications, including:

  • Deposition Processes: Ideal for use in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Suitable for protective coatings, decorative finishes, and display technologies.

Packaging and Handling

Our nickel chromium aluminum evaporation materials are packaged with care to maintain their integrity and prevent any damage during storage and shipping, ensuring they arrive in optimal condition.

Contact Us

TFM is a premier manufacturer and supplier of high-purity nickel chromium aluminum evaporation materials. We offer these materials in various forms, including tablets, granules, rods, and wires, with custom options available upon request. Additionally, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing information or to inquire about materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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