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Nickel Iron Evaporation Materials

VD0639 Nickel Iron Evaporation Materials, Ni/Fe

Catalog No.VD0639
MaterialNickel Iron (Ni/Fe)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity nickel-iron evaporation materials, along with a wide range of other evaporation products. We provide these materials in both powder and granule forms, with custom options available to suit specific needs.

MSDS File

Nickel Iron Evaporation Materials Overview

Nickel and iron are two of the most abundant elements in the Earth’s core and are extensively utilized in modern industry. Both metals are ferromagnetic, ductile, and excellent conductors of heat and electricity. Naturally occurring nickel-iron alloys are commonly found in meteorites and are often evaporated under vacuum conditions to form thin films, which are crucial in the production of semiconductors and magnetic storage media.

TFM offers high-purity nickel-iron evaporation materials, composed of a nickel (Ni) and iron (Fe) alloy. These materials are essential for achieving high-quality deposited films in various deposition processes. TFM specializes in producing evaporation materials with purities of up to 99.9995%, ensuring reliable performance through stringent quality assurance practices.

Related Products: Nickel Evaporation Materials, Iron Evaporation Materials

Applications of Nickel Iron Evaporation Materials

TFM’s nickel-iron evaporation materials are widely used in several advanced applications, including:

  • Deposition Processes: Vital for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Applications: Employed in wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our nickel-iron evaporation materials are carefully packaged to prevent any damage during storage and transportation, ensuring that they maintain their high quality and are ready for immediate use.

Contact Us

TFM is a leading provider of high-purity nickel-iron evaporation materials, available in various shapes such as tablets, granules, rods, and wires. Custom forms and quantities can also be arranged to meet your specific requirements. Additionally, TFM supplies a wide range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or inquiries about materials not listed, please contact us directly.

Ordering Table

Material Size Quantity Purity Part Number
Nickel/Iron Nickel Iron (81/19 wt%)1/8" Dia. x 1/8" Length 100 g 99.95% EVMNIFEEXE-D
Nickel/Iron Nickel Iron (81/19 wt%)1/4" Dia. x 1/4" Length 100 g 99.95% EVMNIFEQXQ-D
Nickel/Iron Nickel Iron (81/19 wt%)1/4" Dia. x 1/4" Length 200 g 99.95% EVMNIFEQXQ-H
Nickel/Iron Nickel Iron (81/19 wt%)1/8" Dia. x 1/8" Length 25 99.95% EVMNIFEEXE-A

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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