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Titanium Cobalt Evaporation Materials

VD0652 Titanium Cobalt Evaporation Materials, Ti/Co

Catalog No.VD0652
MaterialTitanium Cobalt (Ti/Co)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM is a top-tier manufacturer and supplier of high-purity titanium cobalt evaporation materials. Our extensive range of evaporation materials includes options in both powder and granule forms. We also offer custom formulations to meet specific requirements, ensuring the highest quality and performance for your applications.

MSDS File

Titanium Cobalt Evaporation Materials Description

Our titanium cobalt evaporation materials are advanced alloys composed of titanium (Ti) and cobalt (Co). These high-purity materials, with purity levels reaching up to 99.9995%, are crucial for achieving superior quality in deposition processes. TFM excels in producing these materials with rigorous quality assurance to ensure consistent performance and reliability.

Applications of Titanium Cobalt Evaporation Materials

Titanium cobalt evaporation materials are versatile and used in various applications:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD), these materials contribute to high-quality thin films.
  • Optical Coatings: They are utilized in applications requiring wear protection, decorative finishes, and displays, enhancing both the durability and appearance of optical components.

Packaging and Handling

Our titanium cobalt evaporation materials are meticulously tagged and labeled to ensure easy identification and quality control. We take significant measures to protect our products from damage during storage and transportation.

Get in Touch

TFM is a leading supplier of high-purity titanium cobalt evaporation materials. We offer these materials in various forms, including tablets, granules, rods, and wires. Custom shapes and quantities can be arranged upon request. In addition to evaporation materials, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For the latest pricing and information on materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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