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Iron(III) Oxide Evaporation Materials

VD0695 Iron(III) Oxide Evaporation Materials, Fe2O3

Catalog No.VD0695
MaterialIron Oxide (Fe2O3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier producer and distributor of high-purity iron(III) oxide evaporation materials. We offer a wide range of evaporation materials in both powder and granule formats, with customization options available to fit your precise requirements. Our commitment to quality ensures that you receive products tailored to your specific applications.

MSDS File

Iron(III) Oxide Evaporation Materials Overview

Iron(III) oxide, with the chemical formula Fe₂O₃, is a critical material in various evaporation processes. At TFM, we provide high-purity iron(III) oxide evaporation materials, known for their exceptional quality and reliability. Our products are essential for achieving top-notch deposited films in a range of applications. We pride ourselves on our rigorous quality assurance, offering materials with purity levels reaching up to 99.9995%.

Key Specifications

Material TypeIron(III) Oxide
SymbolFe2O3
Color/AppearanceRed-brown solid
Melting Point1,539 °C
Theoretical Density 5.25 g/cm3
Purity99.5% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications of Iron(III) Oxide Evaporation Materials

Iron(III) oxide evaporation materials are versatile and find use in numerous areas:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Applications: Used in coatings for wear protection, decorative purposes, and display technologies.

Packaging and Handling

Our iron(III) oxide evaporation materials are meticulously packaged with clear labeling for easy identification and quality control. We ensure that the products are protected from damage during both storage and transportation.

Contact Us

TFM is a top-tier supplier of high-purity iron(III) oxide evaporation materials. We offer various shapes, including tablets, granules, rods, and wires, with customization available to meet your specific needs. In addition to evaporation materials, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to inquire about additional materials, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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