Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Lanthanum Vanadium Oxide Evaporation Materials

VD0704 Lanthanum Vanadium Oxide Evaporation Materials, LaVO3

Catalog No.VD0704
MaterialLanthanum Vanadium Oxide (LaVO3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) specializes in the production and supply of high-purity lanthanum vanadium oxide evaporation materials. Our offerings include a diverse range of evaporation materials, available in both powder and granule forms. Custom formulations are also available to meet specific needs and applications. We are dedicated to delivering superior quality materials for optimal performance in various deposition processes.

MSDS File

Introduction

Cobalt Nickel Vanadium (Co/Ni/V) High-Entropy Alloy (HEA) Sputtering Target is an advanced multi-component alloy designed for next-generation thin film engineering. Unlike conventional binary or ternary alloys, HEAs rely on multiple principal elements to form stable solid-solution phases, resulting in enhanced mechanical strength, corrosion resistance, and structural stability. Co/Ni/V HEA thin films are particularly attractive for functional coatings, magnetic applications, and high-performance surface engineering.

Detailed Description

Our Co/Ni/V HEA Sputtering Targets are produced using vacuum induction melting and homogenization techniques to ensure uniform elemental distribution and phase stability. The alloy composition can be near-equiatomic or adjusted to tailor hardness, magnetic response, electrical conductivity, and oxidation resistance.

Strict control of raw material purity minimizes unwanted intermetallic formation and impurity-driven defects. The targets are machined to precise tolerances and exhibit high density and homogeneous microstructure, which contribute to stable plasma conditions and reduced arcing during sputtering. As a conductive metallic alloy, Co/Ni/V HEA targets are fully compatible with DC sputtering systems and can also be used in RF configurations where required.

For high-power deposition systems, the targets can be indium-bonded or diffusion-bonded to copper backing plates to improve thermal dissipation and extend operational life. Planar round, rectangular, and custom geometries are available to match a wide range of cathode designs.

Applications

Cobalt Nickel Vanadium HEA Sputtering Targets are widely used in:

  • Wear-resistant and corrosion-resistant coatings

  • Magnetic and functional alloy thin films

  • Energy storage and catalytic material research

  • Diffusion barrier and adhesion layers

  • Structural coatings for harsh environments

  • Academic and industrial R&D in high-entropy materials

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionCo/Ni/V (custom ratios)Determines mechanical & magnetic behavior
Purity99.9% – 99.99%Minimizes film defects
Diameter25 – 300 mm (custom available)Compatible with standard cathodes
Thickness3 – 12 mmInfluences target lifetime
Density≥ 99% theoreticalEnsures stable sputtering
Sputtering ModeDC sputtering (typical)Suitable for conductive alloys
BondingUnbonded / Cu backing (optional)Enhances heat management

Comparison with Related Alloy Targets

MaterialKey AdvantageTypical Application
Co/Ni/V HEAHigh entropy stabilization & tunable propertiesAdvanced functional coatings
Co/Ni AlloyMagnetic performanceMagnetic thin films
Ni/V AlloyStrength & corrosion resistanceProtective layers
Conventional Ternary AlloySimpler compositionStandard industrial coatings

FAQ

QuestionAnswer
Can the elemental ratios be customized?Yes, alloy composition can be tailored to specific mechanical, magnetic, or corrosion requirements.
Is DC sputtering recommended?Yes, the alloy is conductive and ideal for DC sputtering systems.
Are bonded targets available?Yes, copper backing plates can be provided for high-power applications.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or wooden crates.

Packaging

Our Cobalt Nickel Vanadium High-Entropy Alloy Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each target is vacuum-sealed to prevent oxidation and carefully packed to avoid mechanical damage during transport.

Conclusion

Cobalt Nickel Vanadium High-Entropy Alloy (Co/Ni/V) Sputtering Target offers a robust platform for depositing compositionally complex thin films with enhanced mechanical stability and tunable functional properties. With precise alloy control, high density, and customizable configurations, it is ideally suited for advanced coating systems and high-entropy alloy research.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Reviews

There are no reviews yet.

Be the first to review “VD0704 Lanthanum Vanadium Oxide Evaporation Materials, LaVO3”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

Shopping Cart
Scroll to Top