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VD0704 Lanthanum Vanadium Oxide Evaporation Materials, LaVO3

Catalog No.VD0704
MaterialLanthanum Vanadium Oxide (LaVO3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) specializes in the production and supply of high-purity lanthanum vanadium oxide evaporation materials. Our offerings include a diverse range of evaporation materials, available in both powder and granule forms. Custom formulations are also available to meet specific needs and applications. We are dedicated to delivering superior quality materials for optimal performance in various deposition processes.

MSDS File

Lanthanum Vanadium Oxide Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) offers high-purity lanthanum vanadium oxide evaporation materials, with the chemical formula LaVO₃. Our lanthanum vanadium oxide materials are essential for achieving high-quality films in various deposition processes. We produce these materials with purity levels up to 99.9995%, ensuring exceptional performance and reliability through rigorous quality assurance.

Related Products: Lanthanum Evaporation Materials, Vanadium Evaporation Materials

Applications

Lanthanum vanadium oxide evaporation materials are utilized in:

  • Deposition Processes: Suitable for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Ideal for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our lanthanum vanadium oxide materials are meticulously tagged and labeled to ensure accurate identification and stringent quality control. We take extensive measures to protect the materials from damage during storage and transportation.

Contact Us

At Thin-Film Mat Engineering (TFM), we provide high-purity lanthanum vanadium oxide evaporation materials in various forms, including tablets, granules, rods, and wires. Customized shapes and quantities are available upon request. Additionally, we offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about additional materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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