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zinc-oxide-doped-with-gallium-oxide-evaporation-materials

VD0744 Zinc Oxide doped with Gallium Oxide Evaporation Materials, ZnO/Ga2O3

Catalog No.VD0744
MaterialZinc Oxide doped with Gallium Oxide
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM stands at the forefront of manufacturing and supplying premium-grade Zinc Oxide doped with Gallium Oxide, alongside a diverse range of evaporation materials. Our offerings include both powder and granule forms of these materials, with customization options available to meet specific requirements.

MSDS File

Zinc Oxide Doped with Gallium Oxide Evaporation Materials: Detailed Overview

TFM’s Zinc Oxide doped with Gallium Oxide evaporation materials are high-purity compounds with the formula ZnO/Ga₂O₃. These materials are essential for achieving top-notch quality in deposition processes, ensuring the production of superior thin films. Our products are manufactured to an impressive purity level of up to 99.9995%, underscoring our dedication to quality and reliability.

Applications

Our Zinc Oxide doped with Gallium Oxide evaporation materials are used in various advanced technologies, including:

  • Deposition Processes: Perfect for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and display technologies.

Packaging and Handling

To ensure the integrity of our products, each Zinc Oxide doped with Gallium Oxide package is clearly labeled and tagged for efficient identification and quality control. We take meticulous care to prevent any damage during storage and transportation.

Contact Us

TFM is a leading manufacturer and supplier of high-purity Zinc Oxide doped with Gallium Oxide evaporation materials. We offer various forms, including tablets, granules, rods, and wires, with customization options available upon request. In addition to evaporation materials, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about products not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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