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Niobium Nitride Evaporation Materials

VD0753 Niobium Nitride Evaporation Materials, NbN

Catalog No.VD0753
MaterialNiobium Nitride (NbN)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top producer and provider of ultra-pure Niobium Nitride for evaporation applications, alongside an extensive range of other evaporation materials. Our products are available in both powder and granule formats, and we can also tailor solutions to meet specific customer requirements.

MSDS File

Niobium Nitride Evaporation Materials Overview

Niobium Nitride (NbN) evaporation materials from TFM are high-purity nitride ceramics essential for advanced deposition processes. With a chemical formula of NbN, these materials ensure the production of high-quality deposited films. TFM is renowned for its commitment to excellence, producing evaporation materials with a purity level of up to 99.9995%, supported by rigorous quality control measures.

Niobium Nitride Evaporation Materials Specification

Material TypeNiobium Nitride
SymbolNbN
Appearance/ColorGray solid
Melting Point2,573 °C
Density8.470 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications of Niobium Nitride Evaporation Materials

Niobium Nitride evaporation materials are versatile and used in several high-tech applications:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear protection, decorative coatings, and display technologies.

Packaging and Handling

TFM ensures that Niobium Nitride evaporation materials are meticulously tagged and labeled for efficient identification and quality assurance. The packaging is designed to prevent any damage during storage and transportation.

Contact Information

As a premier provider of high-purity Niobium Nitride evaporation materials, TFM offers various forms including tablets, granules, rods, and wires. Custom shapes and quantities can be requested. In addition to evaporation materials, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional inquiries, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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