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Boron Carbide Evaporation Materials

VD0760 Boron Carbide Evaporation Materials, B4C

Catalog No.VD0760
MaterialBoron Carbide (B4C)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier specializing in high-purity Boron Carbide and an extensive range of evaporation materials. Our offerings include both powder and granule forms of these materials, with the flexibility to create customized solutions to meet specific needs upon request.

MSDS File

Boron Carbide Evaporation Materials Description

TFM’s Boron Carbide evaporation material is a high-performance carbide ceramic with the chemical formula B4C. Renowned for its high purity, up to 99.9995%, our Boron Carbide materials are crucial in deposition processes, ensuring the production of high-quality deposited films. TFM’s rigorous quality assurance processes ensure the reliability and consistency of our evaporation materials.

Related Products: Boron Evaporation Materials, Carbide Ceramic Evaporation Materials

Boron Carbide Evaporation Materials Specifications

Material TypeBoron Carbide
SymbolB4C
Appearance/ColorDark gray or black solid
Melting Point2,763 °C (5,005 °F; 3,036 K)
Density2.52 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Boron Carbide Evaporation Materials Applications

Our Boron Carbide evaporation materials are used in:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Employed in wear protection, decorative coatings, and display technologies.

Boron Carbide Evaporation Materials Packaging

We ensure that Boron Carbide evaporation materials are meticulously tagged and labeled for clear identification and quality control. Our packaging is designed to prevent damage during storage and transportation.

Contact Us

For detailed information about our Boron Carbide evaporation materials, including various forms such as tablets, granules, rods, and wires, please contact us. TFM also offers custom forms and quantities to meet your specific needs. In addition to evaporation materials, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. Reach out to us for current pricing and details on additional materials not listed.

Ordering Table

Material Size Quantity Purity Part Number
Boron Carbide 3mm - 12mm 500 g 99.5% EVMBC25312T
Boron Carbide 3mm - 6mm 100 g 99.5% EVMBC2536D
Boron Carbide 3mm - 6mm 250 g 99.5% EVMBC2536J
Boron Carbide 3mm - 6mm 1 kg 99.5% EVMBC2536KG
Boron Carbide 3mm - 6mm 500 g 99.5% EVMBC2536T

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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