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Hafnium Carbide Evaporation Materials

VD0762 Hafnium Carbide Evaporation Materials, HfC

Catalog No.VD0762
MaterialHafnium Carbide (HfC)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier of high-purity Hafnium Carbide evaporation materials. Our extensive range includes both powder and granule forms, tailored to meet diverse application needs. For those with specific requirements, we also offer customized forms upon request. Trust TFM for reliable and high-quality evaporation materials that support your advanced deposition processes.

MSDS File

Hafnium Carbide Evaporation Materials Overview

TFM provides top-quality Hafnium Carbide evaporation materials, distinguished by their high purity and effectiveness in deposition processes. With the chemical formula HfC, this carbide ceramic material is crucial for producing high-quality deposited films. TFM ensures that our Hafnium Carbide evaporation materials reach up to 99.9995% purity, thanks to our comprehensive quality assurance procedures.

Hafnium Carbide Evaporation Materials Specification

Material TypeHafnium Carbide
SymbolHfC
Appearance/ColorBlack odorless solid
Melting Point3,958 °C (7,156 °F; 4,231 K)
Density12.2 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications

Hafnium Carbide evaporation materials are versatile and used in a variety of applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our Hafnium Carbide evaporation materials are meticulously packaged to ensure safe handling and maintain quality during transport. Each package is clearly labeled for efficient identification and quality control, minimizing the risk of damage.

Contact Us

TFM is a leading manufacturer and supplier of high-purity Hafnium Carbide evaporation materials. We offer a range of shapes, including tablets, granules, rods, and wires, with custom options available to meet your specific needs. Additionally, TFM provides evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and information on other materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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