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Molybdenum Carbide Evaporation Materials

VD0764 Molybdenum Carbide Evaporation Materials, Mo2C

Catalog No.VD0764
MaterialMolybdenum Carbide (Mo2C)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier provider of high-purity Molybdenum Carbide evaporation materials, renowned for our extensive range of evaporation products. We offer these materials in both powder and granule forms to meet diverse application needs. Additionally, we can supply customized forms tailored to specific requirements upon request.

MSDS File

Molybdenum Carbide Evaporation Materials Overview

Molybdenum Carbide (Mo₂C) is a high-purity carbide ceramic used extensively in evaporation processes. This material is crucial for achieving superior film quality in deposition techniques. TFM specializes in producing Mo₂C with purity levels reaching up to 99.9995%, ensuring exceptional reliability through rigorous quality assurance measures.

Molybdenum Carbide Evaporation Materials Specification

Material TypeMolybdenum Carbide
SymbolMo2C
Appearance/ColorBlack solid
Melting Point2,687 °C (4,869 °F; 2,960 K)
Density8.90 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications

Molybdenum Carbide evaporation materials are versatile and used in various applications, including:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear protection, decorative coatings, and display technologies.

Packaging and Quality Control

Our Molybdenum Carbide materials are carefully packaged with clear labeling for easy identification and quality control. We ensure that our products are protected from damage during storage and transportation.

Contact Us

TFM is a leading manufacturer and supplier of high-purity Molybdenum Carbide evaporation materials, available in various shapes including tablets, granules, rods, and wires. We also offer customized forms and quantities to meet specific needs. In addition, we provide a range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional information on products not listed, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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