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Zirconium Disilicide Evaporation Materials

VD0809 Zirconium Disilicide Evaporation Materials, ZrSi2

Catalog No.VD0809
MaterialZirconium Silicide (ZrSi2)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM excels as a premier manufacturer and supplier of high-purity zirconium silicide evaporation materials, along with an extensive range of other evaporation materials. Our offerings include both powder and granule forms, and we can also provide customized shapes and quantities upon request.

MSDS File

Zirconium Disilicide Evaporation Materials Overview

Zirconium disilicide (ZrSi₂) is a high-quality silicide ceramic material essential for precise deposition processes. TFM offers zirconium disilicide evaporation materials with purity levels up to 99.9995%, ensuring exceptional performance and reliability. These materials are crucial for achieving high-quality deposited films and are produced under rigorous quality assurance protocols.

Specifications of Zirconium Disilicide Evaporation Materials

  • Material Type: Zirconium disilicide
  • Symbol: ZrSi₂
  • Appearance/Color: Gray solid
  • Melting Point: 1,620 °C (2,950 °F; 1,890 K)
  • Density: 4.88 g/cm³
  • Purity: 99.9%
  • Form: Available in powder, granule, or custom shapes

Applications of Zirconium Disilicide Evaporation Materials

Zirconium disilicide evaporation materials are used in various deposition processes, including:

  • Semiconductor deposition
  • Chemical vapor deposition (CVD)
  • Physical vapor deposition (PVD)

They are primarily applied in optics for wear protection, decorative coatings, and displays.

Packaging and Handling

Our zirconium disilicide materials are carefully tagged and labeled to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Contact TFM

TFM is a leading provider of high-purity zirconium disilicide evaporation materials. We offer these materials in various forms, including tablets, granules, rods, and wires, with custom options available upon request. In addition to evaporation materials, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about additional materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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