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Iron(II) Sulfide Evaporation Materials

VD0819 Iron(II) Sulfide Evaporation Materials, FeS

Catalog No.VD0819
MaterialIron Sulfide (FeS)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Iron(II) sulfide, or FeS, is a specialized ceramic evaporation material offered by TFM. This compound is used in various applications requiring the unique properties of sulfide ceramics.

MSDS File

Introduction

Iron(II) Sulfide evaporation materials are important metal sulfide compounds used in thin-film deposition for semiconductor research, energy materials, and functional coatings. With its distinctive electronic and chemical characteristics, Iron(II) Sulfide (FeS) serves as a valuable source material for depositing sulfide-based thin films via vacuum evaporation processes, supporting both fundamental research and emerging device development.

Detailed Description

Iron(II) Sulfide is a binary metal sulfide composed of iron and sulfur, typically exhibiting semiconducting behavior and strong chemical reactivity toward chalcogen-based systems. In thin-film form, FeS has attracted interest for applications related to energy conversion, catalysis, and electronic materials research.

Our Iron(II) Sulfide evaporation materials are synthesized from high-purity iron and sulfur under carefully controlled conditions to achieve consistent stoichiometry and phase stability. The material is processed into pellets, granules, or custom geometries suitable for thermal evaporation and electron-beam evaporation systems. Dense, uniform material structure helps ensure stable evaporation rates and reduces spitting or composition fluctuation during deposition.

Due to the sulfur content, special attention is given to material handling and packaging to minimize oxidation and moisture exposure. When properly evaporated under controlled vacuum conditions, Iron(II) Sulfide enables reproducible thin-film growth with reliable chemical composition.

Applications

Iron(II) Sulfide evaporation materials are commonly used in:

  • Semiconductor and chalcogenide thin-film research

  • Energy-related materials and conversion studies

  • Catalytic and electrochemical thin films

  • Functional sulfide coatings

  • Laboratory-scale thin-film deposition and R&D

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialIron(II) Sulfide (FeS)Defines chemical & electronic behavior
Purity99.9% – 99.99%Minimizes contamination in thin films
FormPellet / Granule / CustomEnsures controlled evaporation
Pellet Size1 – 6 mm (custom available)Fits common crucibles
Deposition MethodThermal / E-beam evaporationCompatible with standard PVD systems
SensitivityMoisture & oxidation sensitiveRequires controlled handling

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Iron(II) Sulfide (FeS)Simple metal sulfide chemistrySulfide thin-film research
Iron Disulfide (FeS₂)Narrow bandgap, photovoltaic interestEnergy materials
Zinc Sulfide (ZnS)Wide bandgapOptical coatings
Copper Sulfide (Cu₂S)High conductivitySemiconductor films

FAQ

QuestionAnswer
Is Iron(II) Sulfide suitable for thermal evaporation?Yes, it is commonly used in thermal and e-beam evaporation systems.
Can material form be customized?Yes, pellets, granules, and custom shapes are available.
How is sulfur loss controlled during evaporation?Optimized material density and controlled deposition conditions help maintain composition.
How is the material packaged?Vacuum-sealed or inert-gas packed to prevent oxidation and moisture exposure.

Packaging

Our Iron(II) Sulfide Evaporation Materials are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each batch is vacuum-sealed or packed under inert atmosphere and protected with shock-absorbing materials to preserve material integrity during storage and transportation.

Conclusion

Iron(II) Sulfide evaporation materials provide a reliable and high-purity source for depositing sulfide-based thin films in research and advanced material development. With controlled composition, stable evaporation behavior, and flexible form options, FeS is a dependable choice for semiconductor, energy, and functional coating studies.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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