Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Iron(II) Sulfide Evaporation Materials

VD0819 Iron(II) Sulfide Evaporation Materials, FeS

Catalog No.VD0819
MaterialIron Sulfide (FeS)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Iron(II) sulfide, or FeS, is a specialized ceramic evaporation material offered by TFM. This compound is used in various applications requiring the unique properties of sulfide ceramics.

MSDS File

Iron(II) Sulfide Evaporation Materials Overview

Iron(II) sulfide (FeS) evaporation materials are essential in various deposition processes to ensure the creation of high-quality thin films. Known for their high purity, these materials are crucial for applications in semiconductor manufacturing, optical coatings, and more. TFM excels in producing these materials with exceptional purity levels, reaching up to 99.9995%.

Specifications

Material TypeIron(II) Sulfide
SymbolFeS
Appearance/ColorGray Solid
Melting Point1,194 °C (2,181 °F; 1,467 K)
Density4.84 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Iron(II) sulfide evaporation materials are widely used in various deposition techniques, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are primarily utilized for:

  • Optical Coatings
  • Wear Protection
  • Decorative Coatings
  • Displays

Packaging and Handling

Our Iron(II) sulfide evaporation materials are carefully packaged and labeled to ensure easy identification and maintain quality during storage and transport. We prioritize preventing any potential damage to the materials throughout the entire handling process.

Contact Us

TFM is a premier supplier of high-purity Iron(II) sulfide evaporation materials, offering various forms such as tablets, granules, rods, and wires. We also provide custom shapes and quantities upon request. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to inquire about materials not listed, please reach out to us directly.

Reviews

There are no reviews yet.

Be the first to review “VD0819 Iron(II) Sulfide Evaporation Materials, FeS”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

Shopping Cart
Scroll to Top