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VD0853 Titanium Diselenide Evaporation Materials, TiSe2

Catalog No.VD0853
MaterialTitanium Selenide (TiSe2)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier specializing in high-purity titanium diselenide evaporation materials, among a diverse range of evaporation products. We provide these materials in both powder and granule forms, with custom options available to meet specific needs. Our commitment to quality ensures that our evaporation materials meet the highest standards for performance and reliability.

Titanium Diselenide Evaporation Materials Overview

At TFM, our titanium diselenide evaporation material, with the chemical formula TiSe₂, is a high-quality selenide ceramic used in advanced deposition processes. Known for its exceptional purity, our TiSe₂ materials are produced to a purity level of up to 99.9995%, ensuring superior performance in film deposition. Our rigorous quality assurance processes guarantee the reliability and excellence of our evaporation materials.

Related Products: Titanium Evaporation Materials

Specifications of Titanium Diselenide Evaporation Materials

Material TypeTitanium diselenide
SymbolTiSe2
Appearance/ColorDark brown
Molecular Weight205.81
StructureOctahedral
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications of Titanium Diselenide Evaporation Materials

Our titanium diselenide evaporation materials are crucial for various deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are particularly useful in optics applications such as wear protection, decorative coatings, and displays, enhancing both functionality and visual appeal.

Packaging and Handling

To maintain the highest quality, our titanium diselenide evaporation materials are clearly tagged and labeled for easy identification and quality control. We ensure careful packaging to prevent any damage during storage and transportation.

Contact Us

TFM is a leading provider of high-purity titanium diselenide evaporation materials. We offer a variety of forms, including tablets, granules, rods, and wires, with custom options available to suit specific requirements. In addition, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For inquiries about current pricing or other materials not listed, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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