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Niobium Telluride Evaporation Materials

VD0866 Niobium Telluride Evaporation Materials, NbTe2

Catalog No.VD0866
MaterialNiobium Telluride (NbTe2)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM is a premier producer and distributor of high-purity niobium telluride evaporation materials, along with a diverse range of other evaporation materials. Our offerings include both powder and granule forms, and we are equipped to provide customized forms to meet specific requirements upon request.

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Niobium Telluride Evaporation Materials Overview

Niobium telluride, a high-purity ceramic material with the chemical formula NbTe2, is crucial in advanced deposition processes. At TFM, we produce niobium telluride evaporation materials with a purity level of up to 99.9995%, ensuring optimal performance and reliability for high-quality film deposition. Our rigorous quality assurance processes guarantee that each batch of niobium telluride meets the highest standards.

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Specifications for Niobium Telluride Evaporation Materials

Material TypeNiobium Telluride
SymbolNbTe2
Appearance/ColorCrystalline solid
Melting PointN/A
Density7.6 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications of Niobium Telluride Evaporation Materials

Niobium telluride evaporation materials are integral in various deposition processes, such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are predominantly used in optics applications, including wear protection, decorative coatings, and display technologies.

Packaging Information

Our niobium telluride evaporation materials are meticulously packaged in plastic vacuum bags to prevent damage and maintain product quality during storage and transport. Each package includes a Certificate of Analysis (COA) to ensure the authenticity and purity of the materials.

Contact Us

TFM specializes in delivering high-purity niobium telluride evaporation materials suitable for semiconductor applications, CVD, PVD, and optical uses. Our expert engineering, manufacturing, and analytical teams collaborate to produce top-tier evaporation materials. For inquiries or more information, please reach out to us today.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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