Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors

Alumina Ceramic Substrate (Al2O3)

MSDS File

Alumina Ceramic Substrate

The Alumina (Al₂O₃) ceramic substrate is a popular choice for various applications due to its relatively straightforward manufacturing process, affordable cost, and versatility. It features a low thermal conductivity of 20 W/m.K, making it suitable for diverse industrial uses.

Physical Properties of Alumina Ceramic Substrate

PropertyValue
MaterialAl₂O₃
Purity96%, 99%, 99.5%
Density (g/cm³)3.78
Hardness (Mohs)9.2
Thermal Conductivity (W/m.K)26
Thermal Expansion (x10⁻⁶/°C)7.2
Dielectric Constant (at 1 MHz)9.6
Flexural Strength (N/mm²)380
Loss Tangent (x10⁻⁴ @ 1 MHz)3.0

Alumina Ceramic Substrate Specifications

  • Standard Size: 100 x 100 x 1.0 mm
  • Customization: Available in various sizes upon request
  • Surface Finish: Polished with surface roughness (Ra) < 0.01 µm

This robust material offers excellent mechanical strength, high thermal stability, and superior dielectric properties, making it a preferred solution across electronic, thermal management, and structural applications.

Reviews

There are no reviews yet.

Be the first to review “Alumina Ceramic Substrate (Al2O3)”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
Shopping Cart
Scroll to Top