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Aluminum Diboride Evaporation Materials, AlB2

Material: Aluminum Boron (AlB2)
Chemical Formula: AlB2
Catalog No.: TFM-EVM-0009
Purity: 99.5%
Shape: Powder/ Granule/ Custom-made

Aluminum Boron (AlB2) evaporation material is supplied by Thin Film Materials (TFM) for vacuum evaporation and thin-film deposition. Available form, size, purity, and packaging can be customized to suit research and production requirements.

Product Overview

Aluminum Diboride Evaporation Materials (AlB2) is a high-melting compound evaporation source for specialized thin-film deposition and materials research. Carbides, borides, nitrides, silicides, and related compounds may require electron-beam heating or other high-energy evaporation methods, and some compounds can decompose or change composition before a useful vapor pressure is reached. The evaporation route should therefore be qualified against the required film chemistry rather than assumed to be congruent.

Evaporation Behavior and Process Considerations

These compounds commonly require high-energy evaporation methods such as electron-beam heating. However, high source temperature can also promote decomposition, dissociation, or preferential evaporation. Process qualification should therefore include source-behavior observation and film-composition verification before scaling to long runs.

Technical Data

Material TypeAluminum Diboride
SymbolAlB2
Appearance/ColorCopper-red solid
Melting Point>920 °C (decomposes)
Density3.19 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Typical Thin-Film Applications

  • Hard, refractory, electronic, protective, and specialty compound thin films
  • High-temperature or advanced-material coating research
  • R&D evaluating decomposition behavior and film stoichiometry under e-beam evaporation

Source Form and Ordering Considerations

For quotation, provide the material or formula, purity, desired source form and size, quantity, evaporation method if known, and any crucible, boat, or e-beam hearth constraints. For compound materials, include the target film composition or application when possible so that source form and process risk can be reviewed together. TFM can supply pellets, pieces, granules, tablets, or other custom forms subject to material manufacturability.

Frequently Asked Questions

Can Aluminum Diboride be evaporated by electron beam?

Electron-beam heating is often evaluated for high-melting compounds because it can provide localized high temperature. However, the compound may decompose before evaporating congruently.

Will Aluminum Diboride maintain its stoichiometry during evaporation?

Not necessarily. Carbides, borides, nitrides, silicides, and related compounds can dissociate or evaporate preferentially, so film composition should be verified.

Why is source conditioning important for Aluminum Diboride?

Gradual conditioning reduces thermal shock, outgassing, and sudden particle ejection while allowing the operator to observe whether the compound remains stable under heating.

What source holder should be used for Aluminum Diboride?

The holder must tolerate the required temperature and avoid chemical reaction with the charge. E-beam hearth or compatible crucible selection should be reviewed for the specific material.

Is a pellet or dense piece preferable for Aluminum Diboride?

A dense, mechanically stable charge is generally easier to load and condition than loose powder. The ideal form depends on hearth size and the required evaporation rate.

What information should I provide for a Aluminum Diboride evaporation-material quotation?

Provide formula, purity, source form, piece or pellet size, quantity, evaporation method, source-holder details, and the intended film composition or application.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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