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VD0829 Aluminum Diboride Evaporation Materials, AlB2

Catalog No.VD0829
MaterialAluminum Boron (AlB2)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM is a prominent manufacturer and supplier of premium aluminum diboride evaporation materials, as well as a broad range of other high-quality evaporation materials. These materials are available in both powder and granule forms, with customization options available to meet specific project needs and requirements. Contact TFM today for tailored solutions and inquiries.

MSDS File

Aluminum Diboride Evaporation Materials Overview

Aluminum diboride (AlB₂) evaporation materials are key components used in various deposition processes. This boride ceramic material is known for its high purity, with TFM offering products with purity levels reaching up to 99.9995%. These materials are crucial in ensuring the production of high-quality deposited films, which are essential in applications such as semiconductor technology and advanced coatings.

Specifications of Aluminum Diboride Evaporation Materials

Material TypeAluminum Diboride
SymbolAlB2
Appearance/ColorCopper-red solid
Melting Point>920 °C (decomposes)
Density3.19 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications

Aluminum diboride evaporation materials are employed in a range of deposition techniques, including:

  • Semiconductor Deposition: Essential for fabricating semiconductor devices.
  • Chemical Vapor Deposition (CVD): Used in creating thin films and coatings.
  • Physical Vapor Deposition (PVD): Applied in producing high-quality optical coatings, wear-resistant layers, decorative finishes, and display technologies.

Packaging and Handling

TFM ensures that aluminum diboride evaporation materials are meticulously tagged and labeled for efficient identification and quality control. The materials are packaged with care to prevent damage during storage and transport, ensuring their integrity upon delivery.

Contact Us

TFM stands out as a premier supplier of high-purity aluminum diboride evaporation materials, available in various forms including tablets, granules, rods, and wires. Custom shapes and quantities can be provided upon request. In addition, TFM offers a range of related products such as evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing and further inquiries, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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