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Aluminum-doped Zinc Oxide Rotary Sputtering Target

Aluminum-doped Zinc Oxide Rotary Sputtering Target (AZO)

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Introduction

TFM offers high-quality Aluminum-doped Zinc Oxide Rotary Sputtering Target (AZO), ideal for transparent conductive films used in a wide range of electronic, optoelectronic, and solar applications. AZO is a highly effective alternative to indium tin oxide (ITO), providing excellent electrical conductivity, optical transparency, and chemical stability.

The rotary sputtering target design ensures efficient and uniform deposition of AZO films, making them perfect for transparent conductive layers in solar cells, touchscreens, and displays. AZO films are also used in transparent electrodes, optical coatings, and sensors, thanks to their low resistivity and high optical transmission in the visible spectrum. Additionally, the aluminum doping enhances the electrical properties of zinc oxide, further optimizing the films’ performance for advanced technologies.

TFM provides customized AZO rotary sputtering targets, ensuring precise control over composition and purity for optimal film deposition. These targets are designed for high-performance applications in industries like solar energy, electronics, and coatings, delivering reliable results in thin-film deposition processes.

Aluminum-doped Zinc Oxide Rotary Sputtering Target (AZO) Specifications

MaterialsAluminum-doped Zinc Oxide Rotary Sputtering Target
SymbolAl₂O₃/ZnO, AZO
CompositionAl₂O₃/ZnO 2/98 wt% or other ratios
Purity≥99.95%
Theoretical Density (g/cc)5.56
Melting Point (°C)N/A
Production MethodBonded Type (Cold isostatic pressing + high-temperature sintering)
Backing TubeTitanium, Stainless Steel
Bonding MaterialIndium or Elastomer
SizeAs per customer’s drawings
Relative Density≥97%
Resistivity (Ω·cm)≤0.001
Annual Capacity1,000 tons

Applications

  • Thin Film Photovoltaic Solar Industry
  • Semiconductor Electronics Industry
  • Flat Panel Display Industry
  • Construction / Automotive Glass Industry

For further details or to order, please contact TFM directly.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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