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VD0534 Aluminum (Al) Evaporation Materials

Material TypeAluminum
SymbolAl
Color/AppearanceSilvery, Metallic
Purity99.9% ~ 99.9995%
ShapePowder/ Granule/ Custom-made

TFM supplies high-purity Aluminum evaporation materials, standing out as a leading manufacturer and supplier in the industry. We offer a diverse range of evaporation materials, including powder, granule, and customized forms, tailored to meet your specific needs.

Introduction

Aluminum (Al) Evaporation Materials are among the most widely used source materials in physical vapor deposition (PVD) processes, particularly thermal evaporation and electron-beam evaporation. Owing to aluminum’s excellent electrical conductivity, high reflectivity, and strong adhesion to a wide range of substrates, Al evaporation materials are essential in semiconductor fabrication, optical coatings, display technologies, and decorative applications. Their stable evaporation behavior and cost-effectiveness make them a foundational material for both industrial production and research environments.

Detailed Description

Aluminum evaporation materials are produced from high-purity aluminum refined through vacuum melting and controlled solidification processes to minimize impurities and dissolved gases. This ensures clean evaporation, reduced spitting, and consistent film quality during deposition.

Aluminum is especially valued for its relatively low melting point compared with refractory metals, allowing efficient thermal evaporation while remaining fully compatible with electron-beam evaporation for higher deposition rates and precise thickness control. During evaporation, aluminum forms smooth, continuous films with excellent step coverage and strong adhesion to substrates such as glass, silicon, polymers, and ceramics.

Al evaporation materials are commonly supplied in forms such as pellets, granules, wire, shots, and custom-cut pieces to match different evaporation sources, including boats, crucibles, and e-beam hearths. Controlled geometry and surface cleanliness help achieve stable evaporation rates and uniform film thickness, which are critical for high-throughput and multilayer coating processes.

Applications

Aluminum evaporation materials are widely used in the following applications:

  • Semiconductor devices: Metallization layers, electrodes, and interconnects

  • Optical coatings: High-reflectivity mirrors and reflective layers

  • Display technologies: Conductive and reflective films in LCD and OLED systems

  • Decorative coatings: Bright metallic finishes with corrosion resistance

  • Packaging films: Barrier and reflective layers for flexible packaging

  • Research & development: Thin-film studies and prototype device fabrication

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialAluminum (Al)Determines conductivity and reflectivity
Purity99.9% – 99.999%Reduces contamination and improves film quality
FormPellets, granules, wire, shotsCompatible with various evaporation sources
Diameter / SizeCustom availableControls evaporation rate
Melting Point~660 °CEnables efficient thermal evaporation
Evaporation MethodThermal / E-beamFlexible process compatibility

Comparison with Related Evaporation Materials

MaterialKey AdvantageTypical Application
Aluminum (Al)High reflectivity, excellent conductivityOptical & semiconductor films
Silver (Ag)Highest reflectivityPrecision optical mirrors
Chromium (Cr)Strong adhesion layerOptical underlayers
Nickel (Ni)Mechanical durabilityFunctional coatings

FAQ

QuestionAnswer
Can aluminum evaporation materials be customized?Yes, purity, form, and dimensions can be tailored.
Which evaporation method is best for aluminum?Both thermal and electron-beam evaporation are commonly used.
Are aluminum films prone to oxidation?Aluminum forms a thin native oxide, which can be controlled through process conditions.
How are the materials packaged?Vacuum-sealed with moisture-resistant protective packaging.

Packaging

Our Aluminum (Al) Evaporation Materials are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each batch is vacuum-sealed and protected with reinforced cushioning to prevent oxidation, contamination, or mechanical damage during storage and transportation.

Conclusion

Aluminum (Al) Evaporation Materials offer a reliable, versatile, and cost-effective solution for producing high-quality metallic thin films. With stable evaporation behavior, flexible form options, and consistent purity control, aluminum remains a preferred evaporation material across semiconductor, optical, and industrial coating applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Ordering Table

Material Size Quantity Purity Part Number
Aluminum 1/4" Dia. x 1/2" Length 1 lb. 99.95% EVMAL1199QXH
Aluminum 1/4" Dia. x 1/2" Length 1 lb. 99.99% EVMAL40QXH
Aluminum 1/4" Dia. x 1/2" Length 50 g 99.99% EVMAL40QXHB
Aluminum 1/4" Dia. x 1/2" Length 100 g 99.99% EVMAL40QXHD
Aluminum 1/4" Dia. x 1/2" Length 250 g 99.99% EVMAL40QXHJ
Aluminum 1/4" Dia. x 1/2" Length 1 kg 99.99% EVMAL40QXHKG
Aluminum 1/4" Dia. x 1/2" Length 1 lb. 99.999% EVMAL50QXH
Aluminum 1/4" Dia. x 1/2" Length 50 g 99.999% EVMAL50QXHB
Aluminum 1/4" Dia. x 1/2" Length 100 g 99.999% EVMAL50QXHD
Aluminum 1/4" Dia. x 1/2" Length 250 g 99.999% EVMAL50QXHJ
Aluminum 1/4" Dia. x 1/2" Length 1 kg 99.999% EVMAL50QXHKG
Aluminum 1/4" Dia. x 1/4" Length 1 lb. 99.95% EVMAL1199QXQ
Aluminum 1/4" Dia. x 1/4" Length 1 lb. 99.99% EVMAL40QXQ
Aluminum 1/4" Dia. x 1/4" Length 25 g 99.99% EVMAL40QXQA
Aluminum 1/4" Dia. x 1/4" Length 50 g 99.99% EVMAL40QXQB
Aluminum 1/4" Dia. x 1/4" Length 100 g 99.99% EVMAL40QXQD
Aluminum 1/4" Dia. x 1/4" Length 250 g 99.99% EVMAL40QXQJ
Aluminum 1/4" Dia. x 1/4" Length 1 kg 99.99% EVMAL40QXQKG
Aluminum 1/4" Dia. x 1/4" Length 500 g 99.99% EVMAL40QXQT
Aluminum 1/4" Dia. x 1/4" Length 1 lb. 99.999% EVMAL50QXQ
Aluminum 1/4" Dia. x 1/4" Length 25 g 99.999% EVMAL50QXQ-A
Aluminum 1/4" Dia. x 1/4" Length 50 g 99.999% EVMAL50QXQ-B
Aluminum 1/4" Dia. x 1/4" Length 100 g 99.999% EVMAL50QXQ-D
Aluminum 1/4" Dia. x 1/4" Length 250 g 99.999% EVMAL50QXQ-J
Aluminum 1/4" Dia. x 1/4" Length 500 g 99.999% EVMAL50QXQ-T
Aluminum 1/4" Dia. x 1/4" Length 1 kg 99.999% EVMAL50QXQKG
Aluminum 1/8" Dia. x 1/4" Length 1 lb. 99.999% EVMAL50EXQ
Aluminum 1/8" Dia. x 1/4" Length 25 g 99.999% EVMAL50EXQA
Aluminum 1/8" Dia. x 1/4" Length 50 g 99.999% EVMAL50EXQB
Aluminum 1/8" Dia. x 1/4" Length 100 g 99.999% EVMAL50EXQD
Aluminum 1/8" Dia. x 1/4" Length 250 g 99.999% EVMAL50EXQJ
Aluminum 1/8" Dia. x 1/8" Length 1 lb. 99.99% EVMAL40EXE
Aluminum 1/8" Dia. x 1/8" Length 25 g 99.99% EVMAL40EXEA
Aluminum 1/8" Dia. x 1/8" Length 50 g 99.99% EVMAL40EXEB
Aluminum 1/8" Dia. x 1/8" Length 100 g 99.99% EVMAL40EXED
Aluminum 1/8" Dia. x 1/8" Length 250 g 99.99% EVMAL40EXEJ
Aluminum 1/8" Dia. x 1/8" Length 1 kg 99.99% EVMAL40EXEKG
Aluminum 1/8" Dia. x 1/8" Length 1 lb. 99.999% EVMAL50EXE
Aluminum 1/8" Dia. x 1/8" Length 25 g 99.999% EVMAL50EXEA
Aluminum 1/8" Dia. x 1/8" Length 50 g 99.999% EVMAL50EXEB
Aluminum 1/8" Dia. x 1/8" Length 100 g 99.999% EVMAL50EXED
Aluminum 1/8" Dia. x 1/8" Length 200 g 99.999% EVMAL50EXEH
Aluminum 1/8" Dia. x 1/8" Length 250 g 99.999% EVMAL50EXEJ
Aluminum 1/8" Dia. x 1/8" Length 1 kg 99.999% EVMAL50EXEKG

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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