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Aluminum Magnesium Evaporation Materials

VD0596 Aluminum Magnesium Evaporation Materials, Al/Mg

Catalog No.VD0596
MaterialAluminum Magnesium (Al/Mg)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a prominent manufacturer and supplier of high-purity aluminum magnesium evaporation materials. We offer a diverse range of evaporation materials, including aluminum magnesium alloys, to meet various application needs. Our products are available in several forms, including powders and granules, with customized options available upon request.

MSDS File
Aluminum Magnesium Evaporation Materials

High-purity aluminum magnesium evaporation materials are essential for ensuring the quality of deposited films in various deposition processes. TFM specializes in producing aluminum magnesium evaporation materials with purity levels reaching up to 99.9995%, backed by rigorous quality assurance processes to ensure exceptional reliability.

Specifications

Material TypeAluminum Chromium
Color/AppearanceGray
Purity99.9% ~ 99.9995%
ShapePowder/ Granule/ Custom-made

Applications

Our aluminum magnesium evaporation materials are used in several key applications, including:

  • Deposition Processes: Semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Wear protection, decorative coatings, and displays.

Packaging and Handling

We prioritize the integrity of our aluminum magnesium evaporation materials by carefully handling them during storage and transportation. This ensures that the products maintain their high quality and are delivered in optimal condition.

Contact Us

TFM is a leading provider of high-purity aluminum magnesium evaporation materials and a wide range of other evaporation materials. We offer our products in powder and granule forms, with customized options available upon request. For current pricing and information on evaporation materials not listed, please send us an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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