Aluminum Magnesium Sputtering Target Description
The aluminum magnesium sputtering target from TFM is an alloy sputtering material containing aluminum (Al) and magnesium (Mg).
Magnesium:
- Origin: Derived from Magnesia, a district of Eastern Thessaly in Greece.
- Discovery: First mentioned in 1755 by J. Black, with isolation later accomplished and announced by H. Davy.
- Symbol: Mg
- Atomic Number: 12
- Position in Periodic Table: Period 3, Group 2, s-block
- Relative Atomic Mass: 24.3050(6) Dalton
Aluminum:
- Origin: Derived from the Latin name for alum, ‘alumen’ meaning bitter salt.
- Discovery: First mentioned in 1825 by H.C. Ørsted, who also accomplished its isolation.
- Symbol: Al
- Atomic Number: 13
- Position in Periodic Table: Period 3, Group 13, p-block
- Relative Atomic Mass: 26.9815386(8) Dalton
The aluminum magnesium sputtering target combines the properties of both aluminum and magnesium, making it suitable for various high-performance applications in advanced industries.
Aluminum Magnesium Sputtering Target Specification
Material Type | Aluminum Magnesium |
Symbol | Al/Mg |
Color/Appearance | Silvery, Metallic Target |
Melting Point | 600 °C |
Density | 1.9 g/cm3 |
Available Sizes | Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ Thick: 0.125″, 0.250″ |
We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.
Aluminum Magnesium Sputtering Target Application
Aluminum Magnesium Sputtering Target Packing
Our aluminum magnesium sputter coater targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage that might be caused during storage or transportation.
Get Contact
TFM offers Aluminum Magnesium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.
Reviews
There are no reviews yet.