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VD0597 Aluminum Nickel Evaporation Materials, Al/Ni

Catalog No.VD0597
MaterialAluminum Nickel (Al/Ni)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is renowned for producing high-purity aluminum nickel evaporation materials, utilizing rigorous quality assurance processes to ensure reliable and consistent performance. Our aluminum nickel evaporation materials are available in various forms, including tablets, granules, rods, and wires, to meet a wide range of application requirements.

MSDS File

Aluminum Nickel Evaporation Materials

Aluminum nickel evaporation materials from TFM are high-quality alloys composed of aluminum (Al) and nickel (Ni). These materials are integral to various deposition processes, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are widely used in optics for applications such as wear protection, decorative coatings, and displays.

Specifications

MaterialAluminum Nickel
AppearanceGray Solid
Melting Point1385 °C
Density7.5g/cm3

Applications

Our aluminum nickel evaporation materials are utilized in several critical areas:

  • Deposition Processes: Essential for semiconductor deposition, CVD, and PVD.
  • Optics: Ideal for wear protection, decorative coatings, and display technologies.

Packaging and Handling

We ensure that our aluminum nickel evaporation materials are handled with care to prevent damage during storage and transportation. This meticulous approach preserves the quality of our products, ensuring they arrive in optimal condition.

Our Offerings

TFM provides a wide range of evaporation materials, including both pure metals and alloys. We also supply ceramic oxides, such as rare earth oxides (Sc2O3, Y2O3, La2O3), as well as other ceramics like fluorides and nitrides. Our materials come in various forms, including tablets, granules, rods, and wires, with customized shapes and quantities available upon request. Additionally, we offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and availability of evaporation pellets and other deposition materials not listed, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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