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Aluminum Nitride Ceramic Substrate

Aluminum Nitride Ceramic Substrate (AlN)

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Aluminum Nitride Ceramic Substrate

The Aluminum Nitride (AlN) ceramic substrate is known for its exceptional thermal conductivity, superior electrical properties, high mechanical strength, and excellent resistance to high temperatures. Its chemical corrosion resistance, high electrical resistivity, low dielectric loss, and non-toxic nature make it an outstanding alternative to BeO ceramics. Due to these advantages, AlN substrates are widely used in high-density hybrid circuits, microwave power devices, power electronics, optoelectronic components, and semiconductor refrigeration systems.

Physical Properties of Aluminum Nitride Ceramic Substrate

PropertyValue
MaterialAlN
Density (g/cm³)3.335
Hardness (Mohs)8
Thermal Conductivity (W/m.K)180
Thermal Expansion (x10⁻⁶/°C)4.0
Dielectric Constant (at 1 MHz)8.8
Flexural Strength (N/mm²)450

Specifications

  • Standard Size: 100 x 100 x 1.0 mm
  • Customization: Available upon request
  • Polish Options: SSP or DSP
  • Surface Roughness (Ra): 0.01 to 0.7 µm

Applications

Aluminum Nitride ceramic substrates are used in various industries, including:

  • Automotive Electronics: Ideal for advanced electronic components
  • Semiconductor Refrigeration Devices: Efficient heat dissipation solutions
  • LED Lighting: Enhancing thermal management for high-performance lighting systems
  • Power Resistors: Suitable for high-power applications

With superior thermal and mechanical properties, Aluminum Nitride ceramic substrates are a reliable choice for demanding industrial applications.

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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