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VD0747 Aluminum Nitride Evaporation Materials, AlN

Catalog No.VD0747
MaterialAluminum Nitride (AlN)
Purity99.5% ~ 99.9%
ShapePowder/ Granule/ Custom-made

TFM is a top-tier manufacturer and supplier of high-purity Aluminum Nitride (AlN) evaporation materials. We offer a broad selection of evaporation materials, available in both powder and granule forms. For specialized needs, we also provide custom solutions tailored to your specific requirements.

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Aluminum Nitride Evaporation Materials Overview

Aluminum Nitride (AlN) evaporation materials are essential for high-performance deposition processes. With a chemical formula of AlN, this nitride ceramic material from TFM is renowned for its high purity and reliability, making it a preferred choice for ensuring high-quality deposited films. TFM’s commitment to quality assurance means we produce AlN materials with purity levels up to 99.9995%.

Aluminum Nitride Evaporation Materials Specification

Compound FormulaAlN
AppearanceWhite to pale yellow powder
Melting Point2200 °C
Boiling Point2517 °C
Density2.9 to 3.3 g/cm3
Electrical Resistivity10 to 12 10x Ω-m
Specific Heat780 J/kg-K
ShapePowder/ Granule/ Custom-made

Applications of Aluminum Nitride Evaporation Materials

Aluminum Nitride evaporation materials are versatile and utilized in several advanced applications:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Used for wear protection, decorative coatings, and displays.

Packaging and Handling

Our Aluminum Nitride evaporation materials are meticulously packaged to prevent damage during storage and transit. Each package is clearly tagged and labeled to ensure easy identification and maintain high quality.

Contact Us

TFM is a leading supplier of high-purity Aluminum Nitride evaporation materials. We offer a range of forms including tablets, granules, rods, and wires, with custom options available upon request. In addition to evaporation materials, we also provide related products such as evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For inquiries about pricing and additional materials, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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