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VD0668 Aluminum Oxide Evaporation Materials, Al2O3

Catalog No.VD0668
MaterialAluminum Oxide (Al2O3)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier manufacturer and supplier of high-purity Al2O3 aluminum oxide evaporation materials. We provide a diverse range of evaporation materials, available in both powder and granule formats. Additionally, we offer customization options to meet specific needs.

MSDS File

Aluminum Oxide Evaporation Materials Overview

Aluminum oxide, or Al2O3, is a high-purity material commonly appearing as white or clear. It boasts a melting point of 2,072°C, a vapor pressure of 10^-4 Torr at 1,550°C, and a density of 3.97 g/cc. Naturally occurring as corundum, aluminum oxide is the source of gemstones like ruby and sapphire. At TFM, we provide aluminum oxide evaporation materials with purity levels reaching up to 99.9995%, ensuring exceptional performance in deposition processes.

Applications of Aluminum Oxide Evaporation Materials

Our aluminum oxide materials are essential for several advanced applications, including:

  • Deposition Processes: Crucial in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Utilized for wear protection, decorative coatings, and display technologies.

Packaging and Quality Control

To maintain the highest standards of quality, aluminum oxide evaporation materials are meticulously tagged and labeled. Our packaging is designed to prevent any damage during storage and transport, ensuring that you receive your products in optimal condition.

Contact Us

TFM is your go-to source for high-purity Al2O3 aluminum oxide evaporation materials, available in various forms such as tablets, granules, rods, and wires. We also offer customized solutions tailored to your specific requirements. In addition to evaporation materials, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional information on products not listed, please send us an inquiry.

Ordering Table

Material Size Quantity Purity Part Number
Aluminum Oxide 1mm - 2.5mm Pieces 1 kg 99.99% EVMALO-1-2.5
Aluminum Oxide 1mm - 2.5mm Pieces 100 g 99.99% EVMALO-1-2.5D
Aluminum Oxide 1mm - 3mm Pieces 25 g 99.99% EVMALO1-3MMA
Aluminum Oxide 1mm - 3mm Pieces 50 g 99.99% EVMALO1-3MMB
Aluminum Oxide 1mm - 3mm Pieces 100 g 99.99% EVMALO1-3MMD
Aluminum Oxide 1mm - 3mm Pieces 1 kg 99.99% EVMALO1-3MMKG
Aluminum Oxide 1mm - 3mm Pieces 500 g 99.99% EVMALO1-3MMT
Aluminum Oxide 1mm - 5mm Pieces 1 lb 99.99% EVMALO-1220
Aluminum Oxide 1mm - 5mm Pieces 25 g 99.99% EVMALO-1220A
Aluminum Oxide 1mm - 5mm Pieces 50 g 99.99% EVMALO-1220B
Aluminum Oxide 1mm - 5mm Pieces 100 g 99.99% EVMALO-1220D
Aluminum Oxide 1mm - 5mm Pieces 1 kg 99.99% EVMALO-1220KG
Aluminum Oxide 1mm - 5mm Pieces 500 g 99.99% EVMALO-1220T

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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