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VD0598 Aluminum Scandium Evaporation Materials, Al/Sc

Catalog No.VD0598
MaterialAluminum Scandium (Al/Sc)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM excels in producing high-purity aluminum scandium evaporation materials, adhering to stringent quality assurance processes to ensure exceptional product reliability. Our aluminum scandium evaporation materials are available in a range of forms, including tablets, granules, rods, and wires, to suit various application needs.

Aluminum Scandium Evaporation Materials

TFM offers high-quality aluminum scandium evaporation materials, which are alloys composed of aluminum (Al) and scandium (Sc). Known for their superior strength compared to other high-strength alloys, aluminum scandium alloys provide significant benefits including enhanced grain refinement, improved weld strength, and reduced risk of hot cracks in welds.

Applications

Our aluminum scandium evaporation materials are utilized in various key applications:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Ideal for applications such as wear protection, decorative coatings, and display technologies.

Packaging and Handling

We take great care in packaging our aluminum scandium evaporation materials to prevent any damage during storage and transportation, ensuring that the products maintain their high quality and arrive in optimal condition.

What We Supply

TFM provides a broad range of evaporation materials, including pure metals, alloys, and ceramic oxides. Our inventory features rare earth oxides like Sc2O3, Y2O3, and La2O3, as well as other ceramics such as fluorides and nitrides. These materials are available in various forms, including tablets, granules, rods, and wires. Custom shapes and quantities can also be provided upon request. Additionally, we offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and availability of evaporation pellets and other deposition materials not listed, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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