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Aluminum Substrate (Al)

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Aluminum Substrate

Aluminum (Al) single crystal substrates are widely utilized in matrix metals, alloy film materials, and biomaterials, offering an excellent combination of thermal conductivity, electrical properties, and mechanical strength. These substrates are produced using the Bridgman method, ensuring high purity and precise crystallinity, making them suitable for a variety of advanced industrial and scientific applications.

Physical Properties of Aluminum Substrate

PropertyValue
MaterialAluminum
Crystal StructureM3
Growth MethodBridgman Method
Lattice (Å)a = 4.040
Density (g/cm³)Dx = 2.717; Dm = 2.70
Purity> 4N
Melting Point (℃)660

Specifications

  • Standard Sizes: 10×3, 10×5, 10×10, 15×15, 20×15, 20×20 mm
  • Customization: Available upon request
  • Thickness: 0.5 mm, 1.0 mm
  • Crystal Orientation: ＜100＞, <110>, ＜111＞
  • Polish Options: SSP or DSP
  • Redirection Precision: ±0.5°
  • Redirection of Edge: 2° (special in 1°)
  • Angle of Crystalline: Special sizes and orientations available on request
  • Surface Roughness (Ra): ≤5Å (5µm×5µm)

Aluminum Substrate Packaging

  • Packaged in class 100 clean bags or wafer containers, within a class 1000 clean room, to ensure contamination-free handling.

Aluminum substrates are the ideal choice for a wide range of applications requiring high-quality material with excellent thermal and mechanical properties.

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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