Annealed OFHC Copper Gaskets for ConFlat (CF) UHV Flanges
Annealed OFHC Copper Gaskets for ConFlat (CF) UHV Flanges, offered by TFM, are engineered to deliver unmatched vacuum sealing performance in ultra-high vacuum (UHV) and high-vacuum environments. These gaskets are made from high-purity oxygen-free high-conductivity (OFHC) copper and undergo a controlled annealing process to maximize softness and ductility—ensuring a tight, reliable seal every time.
Key Features
Ultra-Pure OFHC Copper Composition
Manufactured from oxygen-free high-conductivity copper (typically >99.99% purity), these gaskets ensure extremely low outgassing and chemical reactivity, making them ideal for sensitive vacuum systems.Annealed for Superior Sealing
The annealing process softens the copper, allowing the gasket to conform precisely to the knife edges of ConFlat flanges. This ensures a consistent metal-to-metal seal, even in extreme UHV conditions.UHV Compatibility
Designed specifically for ConFlat (CF) UHV flanges, these gaskets can maintain vacuum integrity in pressures down to 10⁻¹¹ Torr, supporting applications that require the highest cleanliness and stability.Temperature Resistant
Withstand bake-out processes and operating temperatures up to 450°C in vacuum, making them suitable for demanding thermal cycles and degassing procedures.Non-Magnetic and Chemically Inert
The gaskets are non-magnetic and have no surface treatments or coatings, ensuring compatibility with magnetic-sensitive instruments and processes.
Applications
Ultra-High Vacuum Systems
Used across UHV chambers in scientific research, material analysis, and vacuum coating industries where clean and reliable sealing is essential.Surface Science Equipment
Ideal for systems such as X-ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES), and scanning tunneling microscopy (STM).Cryogenics and Superconductivity
Trusted in cryogenic systems for their excellent thermal conductivity and performance at low temperatures.Accelerator and Synchrotron Facilities
Essential for sealing vacuum beamlines and diagnostic equipment in high-energy physics environments.Thin Film Deposition
Used in sputtering and evaporation systems to preserve vacuum integrity and prevent contamination.
Specifications
Material: Annealed Oxygen-Free High Conductivity Copper
Purity: >99.99%
Hardness: Fully annealed (very soft, ductile)
Flange Compatibility: ConFlat (CF) style flanges
Vacuum Range: Down to 10⁻¹¹ Torr
Temperature Limit: Up to 450°C
Finish: Clean, burr-free edges for optimal sealing performance
Reusability: Single-use gasket; flanges are reusable
Advantages
Provides an ultra-clean seal with minimal risk of contamination
Ensures excellent vacuum performance over long-term use
Easily conforms to minor flange imperfections
No coatings or additives—ideal for ultra-clean applications
Low outgassing—critical for analytical instruments and high-precision systems
Why Choose TFM’s Annealed OFHC Copper Gaskets?
TFM offers precision-manufactured gaskets crafted to the most demanding standards in the vacuum industry. Every annealed OFHC copper gasket is carefully inspected to ensure consistent thickness, softness, and surface finish, delivering the reliable sealing performance our customers expect. Whether you’re working in advanced research, semiconductor fabrication, or high-vacuum processing, TFM gaskets provide dependable UHV sealing with industry-leading quality.
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