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VD0670 Antimony Doped Tin Oxide Evaporation Materials, ATO Evaporation Materials

Catalog No.VD0670
MaterialAntimony Doped Tin Oxide (ATO)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) is a prominent producer and distributor of high-purity antimony-doped tin oxide (ATO) evaporation materials, as well as a diverse selection of other evaporation materials. Our offerings include both powder and granule forms, with custom options available to meet specific needs upon request.

MSDS File

ATO Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) provides high-purity antimony-doped tin oxide (ATO) evaporation materials, featuring the chemical formula ATO. These materials are crucial for achieving superior quality in deposition processes. TFM ensures exceptional reliability with ATO evaporation materials boasting up to 99.9995% purity, thanks to rigorous quality assurance procedures.

Related Products: Antimony Evaporation Materials, Tin Evaporation Materials

Applications of ATO Evaporation Materials

Our ATO evaporation materials are versatile and used in various applications, including:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in protective coatings, decorative finishes, and display technologies.

Packaging and Handling

Our ATO evaporation materials are carefully tagged and labeled to facilitate easy identification and maintain high standards of quality control. We prioritize protecting the materials from any potential damage during storage and transportation.

Contact Us

Thin-Film Mat Engineering (TFM) is a leading supplier of high-purity ATO antimony-doped tin oxide evaporation materials. We offer various forms, including tablets, granules, rods, and wires, with custom shapes and quantities available upon request. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to inquire about materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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