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Antimony Sputtering Target

Chemical Formula: Sb
Catalog Number: TFM-SPT-0028
CAS Number: 7440-36-0
Purity: 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Antimony Sputtering Targets come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Product Overview

Antimony Sputtering Target is an elemental sputtering target used as a direct film source or as a component in composition-sensitive compound-film development. Because many semimetallic or nonmetallic elements are used in optical, electronic, or chalcogenide-related systems, target purity and contamination control can be especially important when the sputtered layer forms part of a functional multilayer stack.

Material and Deposition Characteristics

The preferred power mode depends on the target’s electrical resistivity and the deposition system. Some elemental targets in this family can be processed with DC or pulsed-DC sputtering, while others may require RF sputtering or more conservative operating conditions. When the deposited film acts as a precursor layer for a compound or multilayer system, film analysis is recommended to verify the final composition and structure.

Technical Data

ParameterTypical Value / RangeImportance
Purity99.9% – 99.999%High purity ensures stable electronic and optical film properties
Chemical SymbolSbDetermines elemental composition of thin films
Diameter25 – 300 mm (custom)Compatible with standard sputtering systems
Thickness3 – 6 mmInfluences sputtering efficiency and target lifespan
Density≥ 99% theoretical densityEnsures uniform sputtering and film growth
BondingCopper backing plate / Indium bondedImproves heat dissipation during deposition
MaterialKey AdvantageTypical Application
Antimony (Sb)Important component in phase-change and thermoelectric materialsMemory devices and semiconductor films
Bismuth (Bi)Strong thermoelectric propertiesEnergy conversion materials
Tellurium (Te)Semiconductor and thermoelectric functionalityInfrared detectors and thermoelectric systems
QuestionAnswer
What sputtering methods are suitable for antimony targets?Antimony sputtering targets are commonly used in DC or RF magnetron sputtering systems depending on system configuration.
Can the target size be customized?Yes. Diameter, thickness, and bonding configurations can be tailored to specific sputtering systems.
Are bonded sputtering targets available?Yes. Antimony targets can be bonded to copper backing plates using indium bonding to improve thermal conductivity and stability.
What purity levels are typically available?Standard purities range from 99.9% to 99.999%, depending on application requirements.
What substrates can antimony thin films be deposited on?Antimony films can be deposited on silicon wafers, glass, ceramic substrates, and metallic surfaces.

Typical Thin-Film Applications

  • Antimony-based thin films and precursor layers for semiconductor, optical, and functional coating research
  • Chalcogenide, thermoelectric, infrared, electronic, or phase-change material development where applicable
  • Projects requiring a specific elemental source for co-sputtering or subsequent compound formation

Target Configuration and Ordering Considerations

For quotation and manufacturability review, provide target size, thickness, purity or alloy composition, quantity, and the sputtering gun or cathode model if known. If a bonded assembly is required, include backing-plate material, bonding preference, and any dimensional tolerances, surface-finish needs, or inspection-document requirements. TFM can also review customer drawings or old-target samples for replacement builds.

Frequently Asked Questions

What is a Antimony sputtering target typically used for?

It is used either to deposit the elemental film directly or to serve as a source component in compound, optical, electronic, chalcogenide, or other functional thin-film systems.

Should Antimony be sputtered with DC or RF power?

The best power mode depends on target resistivity, dimensions, and sputtering-system capability. Some elemental targets in this family can work with DC or pulsed-DC power, while others are more commonly evaluated with RF power.

Why is purity important for a Antimony target?

Many of these materials are used in composition-sensitive thin films, so metallic or chemical impurities can affect the behavior of the final film or multilayer stack. The target purity should therefore be matched to the application.

Can a Antimony target be supplied in a bonded assembly?

Yes, if the cathode design or thermal considerations make a backing plate desirable. The specific backing material and bonding method should be reviewed against target size and operating conditions.

Does target composition guarantee film composition for Antimony?

Not always. Film composition can shift because of sputtering conditions, substrate temperature, chamber history, and re-sputtering effects. Film analysis is recommended when the final composition is critical.

What should be included in an RFQ for Antimony?

Provide purity, dimensions, quantity, target configuration, backing requirement if any, cathode model or drawing, and any special packaging or inspection-document requirements.

Order Now

Sb Target 4N 150*50*3mm Indium Bonded 3mm Cu B/Plate, Sb Target 4N 150*50*6mm Indium Bonded 3mm Cu B/Plate, Sb Target ø50.8×3mm Indium Bonded 2mm Cu B/Plate, Sb Target 3N ø15×1.0mm, Sb Target 4N ø2"×3mm Indium Bonded 3mm Cu B/Plate, Sb target 5N 2"×3.18 mm In bonded to 2 mm Cu BP, Sb target 4N ø200×6 mm, Sb Target 4N Ø2"×6.35 mm, Sb Target 5N Ø2"×6.35 mm, Sb Disc 3N Ø15×10 mm, Sb 99.999%, 1.00" Dia. × 0.125" Thick ST0002-01, Sb 99.999%, 1.00" Dia. × 0.250" Thick ST0002-02, Sb 99.999%, 2.00" Dia. × 0.125" Thick ST0002-03, Sb 99.999%, 2.00" Dia. × 0.250" Thick ST0002-04, Sb 99.999%, 3.00" Dia. × 0.125" Thick ST0002-05, Sb 99.999%, 3.00" Dia. × 0.250" Thick ST0002-06, Sb 99.999%, 4.00" Dia. × 0.125" Thick ST0002-07, Sb 99.999%, 4.00" Dia. × 0.250" Thick ST0002-08, Sb 99.999%, 6.00" Dia. × 0.125" Thick ST0002-09, Sb 99.999%, 6.00" Dia. × 0.250" Thick ST0002-10, Sb TRG 4N ø2"*3.18mm, Sb TRG 4N Ø2″×3.18mm, Sb TRG 4N Ø1″×3.18mm Bonded to 3mm Cu BP, Sb TRG 4N Ø3″×3.18mm Bonded to 3mm Cu BP

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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