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ST0002 Antimony Sputtering Target

Chemical Formula: Sb
Catalog Number: ST0002
CAS Number: 7440-36-0
Purity: 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Antimony Sputtering Targets come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

$23.00

Antimony Sputtering Target Description

Antimony

Antimony Sputtering Targets, composed of the semi-metallic element antimony, play a crucial role in thin-film deposition processes. These silvery-gray materials have applications in semiconductor manufacturing, electronics, and various coating technologies. Antimony has a fascinating history, with its compounds being used in ancient times for medicinal and cosmetic purposes, often known by an Arabic name. The element’s discovery in the West was initially marked by misidentification, but it was eventually correctly described in the mid-sixteenth century.

Modern industrial methods for refining antimony involve roasting and reduction processes, typically using carbon or iron. The resulting high-purity antimony is then fashioned into sputtering targets, essential in creating thin films for electronic components, optical coatings, and wear-resistant materials. Antimony’s unique properties make it well-suited for sputtering applications, allowing for efficient deposition under various power conditions. This versatile element continues to be an important material in advanced manufacturing and materials science.

Antimony Sputtering Target Specification

Material Type Antimony
Symbol Sb
Color/Appearance Silvery, Lustrous Gray, Semi-metallic
Melting Point 630 °C
Sputter RF, DC
Density 6.68 g/cc
Thermal Conductivity 24 W/m.K
Type of Bond Indium, Elastomer
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Antimony Sputtering Target Applications

Antimony sputtering targets are essential for creating fire-retardant materials and enhancing safety in commercial and household products. Antimony compounds, especially antimony trichloride, contribute functional and aesthetic properties in flame-resistant formulations, specialized paints, ceramic enamels, and the glass and pottery industries.

Antimony improves the hardness and strength of lead alloys in metallurgy, making them ideal for durable components like ball bearings. This versatility highlights antimony’s crucial role in modern manufacturing, from boosting product safety to enhancing metal alloy performance.

Antimony Sputtering Target Bonding Services

Specialized bonding services for Antimony Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

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Antimony Sputtering Target Packaging

Our Antimony Sputter Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Antimony Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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